Foxconn H77MXV Series - Manual (Page 9)

PRODUCT INTRODUCTION
2
1-1 Product Specifications
CPU Support Intel ® Ivy Bridge/Sandy Bridge LGA1155 Processors
Max processor power up to 95W
For the latest CPU information, please visit:
http://www.foxconnsupport.com/cpusupportlist.aspx
Chipset Intel ® H77
Memory 2 x 240-pin DDR3 DIMMs
Support up to 16GB of system memory
Dual channel DDR3 1600(Ivy Bridge)/1333/1066MHz
Expansion Slots 1 x PCI Express X16 slot
- Support PCI Express Gen2 5GT/S data rate (Sandy Bridge)
- Support PCI Express Gen3 8GT/s data rate (Ivy Bridge)
2 x PCI Express X1 slots
- Support PCI Express Gen2 5GT/S data rate
Storage Intel® H77 chipset
- 2 x SATA 2.0 connectors (3Gb/s data transfer rate)
- 2 x SATA 3.0 connectors (6Gb/s data transfer rate)
Support RAID 0, 1, 5,10
LAN Realtek RTL8111F-CG Gigabit LAN chip
Support 10/100/1000Mbps
Audio Realtek ALC662-GR audio chip
- High Definition Audio
- 2/4/5.1-channel
- Support Jack-Sensing function
USB Support up to 8 x USB 2.0 ports (4 rear panel ports, 2 onboard USB
headers supporting 4 extra ports)
Support USB 2.0 protocol up to 480Mb/s
Support up to 4 x USB 3.0 ports (2 rear panel ports, 1 onboard USB
header supporting 2 extra ports)
Support USB 3.0 protocol up to 5Gb/s
Internal
Connectors 1 x 24-Pin ATX power connector
1 x 4-pin ATX 12V power connector
2 x SATA 3.0 connectors
2 x SATA 2.0 connectors
2 x USB 2.0 headers
1 x USB 3.0 header
1 x CPU FAN header (4-pin)
1 x System FAN header (4-pin)
1 x Front panel header
1 x Front audio header
1 x Speaker header
1 x SPDIF OUT header
1 x TPM header
1 x LPT header
1 x CIR header