1 product specifications – Foxconn B75M User Manual
Page 9
PRODUCT INTRODUCTION
2
1-1 Product Specifications
CPU
Support Intel
®
Ivy Bridge/Sandy Bridge LGA 1155 Processors
Max processor power up to 95W
For the latest CPU information, please visit:
Chipset
Intel
®
Q77
Intel
®
B75
Memory
4 x 240-pin DDR3 DIMMs
Support up to 32GB of system memory
Dual channel DDR3 1600(Ivy Bridge)/1333/1066 MHz architecture
Expansion Slots
1 x PCI Express X16 slot
-Support PCI Express Gen2 5GT/s data rate (Sandy Bridge)
-Support PCI Express Gen3 8GT/s data rate (Ivy Bridge)
1 x PCI Express X1 slot
-Support PCI Express Gen2 5GT/s data rate
2 x PCI slots
Storage
Q77M:
- 4 x SATA 2.0 connectors (3Gb/s data transfer rate)
- 2 x SATA 3.0 connectors (6Gb/s data transfer rate)
- Support RAID 0/1/5/10
B75M:
- 5 x SATA 2.0 connectors (3Gb/s data transfer rate)
- 1 x SATA 3.0 connectors (6Gb/s data transfer rate)
LAN
Q77M:
- Intel 82579LM Lan chip
- Support Intel vPro Technology
- Support 10/100/1000Mbps
B75M:
- Realtek RTL8111F Lan chip
- Support 10/100/1000Mbps
Audio
Realtek ALC662 Audio chip:
- High Definition Audio
-
2/4/5.1-channel
- Support Jack-Sensing function
USB
- Support up to 8 x USB 2.0 ports (2 rear panel ports, 3 onboard USB
headers supporting 6 extra ports)
- Support up to 4 x USB 3.0 ports (2 rear panel ports, 1 onboard USB
headers supporting 2 extra ports)
- Support USB 2.0 protocol up to 480Mb/s
- Support USB 3.0 protocol up to 5Gb/s
Internal
Connectors
1 x 24-pin ATX power connector
1 x 4-pin ATX 12V power connector