Cypress Quad HOTLink II CYV15G0404RB - Manual (Page 26)

CYV15G0404RB
Document #: 38-02102 Rev. *C Page 26 of 27
© Cypress Semiconductor Corporation, 2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
HOTLink is a registered trademark and HOTLink II is a trademark of Cypress Semiconductor. All product and company names
mentioned in this document may be the trademarks of their respective holders.
T03 VCC POWER V15 VCC POWER Y15 VCC POWER
T04 VCC POWER V16 VCC POWER Y16 VCC POWER
T17 VCC POWER V17 RXDA[9] LVTTL OUT Y17 REPDOD LVTTL OUT
T18 VCC POWER V18 RXDA[5] LVTTL OUT Y18 TRGCLKA– PECL IN
T19 VCC POWER V19 RXDA[2] LVTTL OUT Y19 RXDA[8] LVTTL OUT
T20 VCC POWER V20 RXDA[1] LVTTL OUT Y20 RXDA[7] LVTTL OUT
U01 VCC POWER W01 VCC POWER
U02 VCC POWER W02 VCC POWER
Table 6. Package Coordinate Signal Allocation (continued)
Ball
ID
Signal Name Signal Type
Ball
ID
Signal Name Signal Type
Ball
ID
Signal Name Signal Type
Ordering Information
Speed Ordering Code
Package
Name
Package Type
Operating
Range
Standard CYV15G0404RB-BGC BL256 256-Ball Thermally Enhanced Ball Grid Array Commercial
Standard CYV15G0404RB-BGXC BL256 Pb-Free 256-Ball Thermally Enhanced Ball Grid Array Commercial
Package Diagram
Figure 3. 256-Lead L2 Ball Grid Array (27 x 27 x 1.57 mm) BL256
A
B
0.15 C
0.15 C
0.97 REF.
0.60±0.10
1.57±0.175
C
0.20 MIN
SEATING PLANE
SIDE VIEW
SECTION A-A
TOP VIEW
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
A
Ø0.15 M C
Ø0.30 M C
Ø0.75±0.15(256X)
B A
1.27
BOTTOM VIEW (BALL SIDE)
A
0.20(4X)
TOP OF MOLD COMPOUND
TO TOP OF BALLS
26°
TYP.
A1 CORNER I.D.
0.50 MIN.
27.00±0.13
27.00±0.13
24.13
24.13 A1 CORNER I.D.
R 2.5 Max (4X)
12.065
51-85123-*E
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