Kontron AM5010 - Manual (Page 22)

Introduction AM5010
Page 1 - 4 ID 1022-1107, Rev. 4.0
P R E L I M I N A R Y
1.2 Board-Specific Information
Due to the outstanding features of the AM5010, such as superior processing power and flexible
interconnect topologies, this AMC board provides a highly scalable solution not only for a wide
range of telecom and data network applications, but also for several highly integrated industrial
environment applications with solid mechanical interfacing.
Some of the AM5010's outstanding features are:
• Intel® Core™2 Duo processor L7400 (LV), 1.5 GHz, 667 MHz FSB, 4 MB L2 cache
• Intel® 3100 chipset
• Up to 4 GB DDR2 SDRAM memory with ECC running at 400 MHz (PC3200)
• AMC interconnection
•
Dual Gigabit SerDes connection in the Common Options Region
• Dual SATA storage interface in the Common Options Region
• 1x4 or 4x1 PCI Express in the Fat Pipes Region (operates as a root complex controller
only)
• Serial port in the Extended Options Region
• Debug port in the Extended Options Region
• PCI Express clock reference input, FCLKA
• Full hot swap support
• Two Intel® 82571EB Dual Gigabit Ethernet controllers:
•
One controller connected to the Common Options Region
• One controller connected to Front I/O
• Onboard USB 2.0 port for up to 8 GB USB 2.0 NAND Flash memory
• Two USB 2.0 host ports on Front I/O
• One Serial port on Front I/O (RS232)
• Two Gigabit Ethernet ports on Front I/O
• One DVI-I interface on front panel, digital and analog
• One SATA interface for onboard 2.5” SATA HDD/SSD (HDD/SSD optional)
• Two redundant FWH Flash chips for BIOS (2 x 1 MB)
• Battery backed-up real-time clock (RTC)
• Dedicated IPMI Module Management Controller with redundant Firmware Flash (2 x 512 kB)
• Watchdog Timer
• JTAG interface for debugging and manufacturing
• Four bicolor User-Specific LEDs (providing debugging and POST code information, etc.)
• Two onboard DIP switches (for selecting the BIOS bank, overwriting E-Keying, etc.)
• Standard temperature range: -5°C to + 55°C
• Thermal management
• Passive heat sink solution
• Double, Mid-size AMC module
• Designed to be compliant with the following specifications:
• PICMG AMC.0, Advanced Mezzanine Card Specification R2.0 (with mechanical re-
strictions)
• PICMG AMC.1, PCI Express and Advanced Switching R1.0
• PICMG AMC.2, Gigabit Ethernet R1.0
• PICMG AMC.3, Storage Interface R1.0
• PICMG MTCA.0 Micro Telecommunications Computing Architecture R1.0
• IPMI - Intelligent Platform Management Interface Specification, v2.0, R1.0
• AMI BIOS