INFICON PLO-10i Phase Lock Oscillator - Manual (Page 7)

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Table of Contents
OPERATION AND SERVICE MANUAL.................................................................................................. I
1 GENERAL DESCRIPTION............................................................................................................. 1-1
1.1 FEATURES.............................................................................................................................. 1-2
1.1.1 VERY WIDE FREQUENCY RANGE................................................................................... 1-2
1.1.2 SUPPORT FOR VERY LOW Q, HIGHLY DAMPED, CRYSTALS...................................... 1-2
1.1.3 DIRECT REAL TIME MEASUREMENT OF CRYSTAL RESISTANCE .............................. 1-2
1.1.4 ELECTRODE CAPACITANCE CANCELLATION.............................................................. 1-2
1.1.5 “AUTOLOCK”.................................................................................................................... 1-2
1.1.6 CRYSTAL FACE ISOLATION (PLO-10i Models only) ....................................................... 1-3
1.2 CHARACTERIZING THE PLO .............................................................................................. 1-3
1.2.1 FREQUENCY ERRORS....................................................................................................... 1-3
1.2.2 FREQUENCY ERROR DUE TO PHASE ERROR............................................................... 1-3
1.2.3 FREQUENCY ERROR DUE TO IMPERFECT CAPACITANCE CANCELLATION.......... 1-3
1.2.4 CONDUCTANCE ERRORS................................................................................................. 1-5
1.3 SPECIFICATIONS .................................................................................................................. 1-6
1.4 ACCESSORIES ....................................................................................................................... 1-7
2 UNDERSTANDING AND SETTING UP THE INFICON PLO-10............................................. 2-1
2.1 NORMAL OPERATION ......................................................................................................... 2-1
2.2 CHECKOUT ............................................................................................................................ 2-1
3 CALCULATING CRYSTAL RESISTANCE................................................................................. 3-1
4 ADJUSTING THE CAPACITANCE CANCELLATION............................................................. 4-1
4.1 ADJUSTING CAPACITANCE CANCELLATION TRIMMER CAPACITORS ................... 4-1
4.2 WORKING WITH VERY LOW Q CRYSTALS ..................................................................... 4-3
5 FREQUENCY ERRORS DUE TO IMPERFECT CAPACITANCE CANCELLATION.......... 5-1
6 CALCULATING CRYSTAL POWER ........................................................................................... 6-1
7 CRYSTALS, HOLDERS AND FLOW CELL................................................................................ 7-1
7.1 1 INCH DIAMETER CRYSTALS........................................................................................... 7-1
7.1.1 ELECTRODE CONFIGURATION ...................................................................................... 7-1
7.1.2 CRYSTAL PARAMETERS ................................................................................................... 7-2
7.1.3 CRYSTAL SURFACE FINISH ............................................................................................. 7-3
7.1.4 CRYSTAL ELECTRODE MATERIALS................................................................................ 7-3
7.1.5 CRYSTAL THICKNESS ....................................................................................................... 7-3
7.1.6 MASS SENSITIVITY ............................................................................................................ 7-3
7.1.7 STABILITY........................................................................................................................... 7-4
7.1.8 CRYSTAL LIFE EXPECTANCY .......................................................................................... 7-5
7.1.9 TEMPERATURE COEFFICIENT ....................................................................................... 7-5
7.2 CRYSTAL CARE AND HANDLING ..................................................................................... 7-7
7.2.1 CRYSTAL CLEANING......................................................................................................... 7-8
7.2.1.1 General Cleaning ............................................................................................................ 7-8
7.2.1.2 Organic (hydrocarbon contaminants).............................................................................. 7-8
7.2.1.3 Biomaterials (lipids, proteins and similar biomolecules)................................................ 7-8
7.2.1.4 Lipid vesicles on SiO
2
surfaces....................................................................................... 7-8
7.2.1.5 Polystyrene removal ....................................................................................................... 7-9
7.2.2 ELECTRODE SURFACE MODIFICATIONS ..................................................................... 7-9
7.2.2.1 SPIN COATING............................................................................................................. 7-9
7.2.2.2 SELF-ASSEMBLED MONOLAYERS (SAM) ............................................................. 7-9