Implementation temperature specification – DMC TSC-30/IC User Manual
Page 21

Document No. DER-S0098A
20
Version 1.3 ©2012 DMC Co., Ltd.
TSC-30/IC Product Specification
110
20s
175
10
C
1 to 4
C/s
220
C or higher, 50s max.
255
C or higher, 10s max.
260
C max.
Time
Pac
kage’
s s
urfac
e t
em
peratu
re
200
C or higher, 70s max.
8. Implementation Temperature Specification
We do not recommend the wave soldering method.
1. Reflow method (Infrared reflow, air reflow)
Frequency:
Three times or less
Temperature:
The following device surface temperature profile is recommended.
Figure 1: Infrared reflow, air reflow temperature profile
2. Soldering iron (Manual soldering)
Soldering bit
’s temperature:
370
C or lower
Soldering time:
Five seconds or less/terminal