PNI RM3000 Sensor Suites - Manual (Page 19)

RM3000 & RM2000 Sensor Suite User Manual r08 Page 19 of 41
Figure 3-18: Recommended Solder Reflow Profile
Table 3-6: Recommended Solder Processing Parameters
1
Parameter Symbol Value
Preheat Temperature, Minimum T
Smin
150°C
Preheat Temperature, Maximum T
Smax
200°C
Preheat Time (T
Smin
to T
Smax
) 60 – 180 seconds
Solder Melt Temperature T
L
>218°C
Ramp-Up Rate (T
Smax
to T
L
) 3°C/second maximum
Peak Temperature T
P
<260°C
Time from 25°C to Peak (T
P
) 6 minutes maximum
Time above T
L
t
L
60 – 120 seconds
Soak Time (within 5°C of T
P
) t
P
10 – 20 seconds
Rampdown Rate 4°C/second maximum
Footnote:
1. Meets IPC/JEDEC J-STD-020 profile recommendations. Sen-XY and Sen-Z
classified as moisture sensitivity level 1. 3D MagIC classified as moisture
sensitivity level 3.
PB