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Atec Teseq-Schaffner-CBA1G-275 User Manual

Cba 1g-275

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A d v a n c e d Te s t S o l u t i o n s f o r E M C

80 mhz to 1 ghz 275 Watt

Class a BroadBand amplifier

CBa 1g-275

Class A linear and low distortion

design

High reliability gallium arsenide

technology

Mismatch tolerant and uncondi-

tionally stable

Wide instantaneous bandwidth
Typical 2 dB compression data

(as described in IEC 61000-4-3)
provided

Harmonics remain below 20 dBc

at actual 1 dB compression point

Three year parts and labour

warranty

Designed specifically for radiated EMC testing, this mismatch tolerant Class A amplifier delivers power
continuously into the very poor match typically associated with broadband EMC antennas when used
at low frequency.

Since antennas typically exhibit their lowest gain at the lowest frequency, more power is required here
than at the higher frequencies. Unlike other amplifiers designed for general purpose applications, this
EMC specific amplifier maximises the linear power at the lowest frequency, making it ideal for use in
this very specialised application.

The GaAs Class A design ensures a high reliability, low distortion linear performance across the frequency
range. This design also ensures that the amplifier will continue to operate at full power even when
presented with an open or short circuit at its output. The use of gallium arsenide technology represents
a breakthrough in amplifier design for this frequency range and output power. Previous designs based on
silicon technology suffer from relatively poor compression characteristics, low efficiency and sometimes
poor reliability.

The unit is powered from a switched mode power supply for high efficiency, high power factor and wide
voltage range operation. The unit is air-cooled with integral fans, and is protected against faulty cooling
by excess temperature sensing. A safety interlock connector is provided, which the user can short
circuit to ground, to put the amplifier into standby mode. Front panel indicators are provided to indicate
over-temperature and rf interlock operation.