Diodes DLD101 - Manual (Page 3)

DLD101
Document number: DS32007 Rev. 8 - 2
3 of 9
www.diodes.com
April 2010
© Diodes Incorporated
DLD101
NEW PROD
UC
T
Thermal Characteristics
R
, T
H
E
R
M
A
L
R
ESI
ST
A
NCE,
J
UNCT
ION
T
O
AM
BIENT
AIR
(°
C/W
)
θJA
0
20
40
60
80
100
120
140
160
180
0 5 10 15 20 25 30 35 40
COPPER AREA (mm )
2
T = 25°C
A
Fig. 1 Thermal Resistance, Junction to
Ambient Air Characteristic
0
5
10
15
20
25
30
35
40
0 5 10 15 20 25 30 35 40
COPPER AREA (mm )
2
Fig. 2 Thermal Resistance, Junction to
Case Air Characteristic
R
, T
H
E
R
MA
L
R
ESI
ST
ANCE,
J
UNCT
ION
T
O
CASE
AIR (
°C/W
)
θJC
T = 25°C
A
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 5 10 15 20 25 30 35 40
COPPER AREA (mm )
2
Fig. 3 Power Dissipation Characteristic
P
,
P
O
WE
R
DIS
S
IP
A
T
IO
N
(W
)
D
T = 25°C
A