Dmc3025lsd advanced information, Electrical characteristics n-channel, Electrical characteristics p-channel – Diodes DMC3025LSD User Manual
Page 3: Dmc3025lsd
DMC3025LSD
Document number: DS35717 Rev. 5 - 2
3 of 9
August 2012
© Diodes Incorporated
DMC3025LSD
ADVANCED INFORMATION
Electrical Characteristics N-CHANNEL
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
30 —
— V
V
GS
= 0V, I
D
= 250
μA
Zero Gate Voltage Drain Current
I
DSS
—
—
1
μA
V
DS
= 30V, V
GS
= 0V
Gate-Source Leakage
I
GSS
—
—
±1
μA
V
GS
= ±20V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
1.0 — 2.0 V
V
DS
= V
GS
, I
D
= 250
μA
Static Drain-Source On-Resistance
R
DS (ON)
—
15 20
mΩ
V
GS
= 10V, I
D
= 7.4A
—
23 32
V
GS
= 4.5V, I
D
= 6A
Forward Transfer Admittance
|Y
fs
|
—
8 — S
V
DS
= 5V, I
D
= 10A
Diode Forward Voltage
V
SD
—
0.70 1.2 V V
GS
= 0V, I
S
= 1A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
C
iss
—
501 —
pF
V
DS
= 15V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance
C
oss
—
72 —
Reverse Transfer Capacitance
C
rss
—
57 —
Gate resistance
R
g
—
1.84 —
Ω
V
DS
= 0V, V
GS
= 0V, f = 1.0MHz
Total Gate Charge (V
GS
= 4.5V)
Q
g
—
4.6 —
nC
V
DS
= 15V, I
D
= 10A
Total Gate Charge (V
GS
= 10V)
Q
g
—
9.8 —
Gate-Source Charge
Q
gs
—
1.6 —
Gate-Drain Charge
Q
gd
—
2.0 —
Turn-On Delay Time
t
D(on)
—
3.9 —
ns
V
DD
= 15V, V
GS
= 10V,
R
G
= 6
Ω, I
D
= 1A
Turn-On Rise Time
t
r
—
4.2 —
Turn-Off Delay Time
t
D(off)
—
16.6 —
Turn-Off Fall Time
t
f
—
5.8 —
Reverse Recovery Time
t
rr
—
5.5 —
ns
I
F
= 12A, di/dt = 500A/
μs
Reverse Recovery Charge
Q
rr
—
2.6 —
nC
Electrical Characteristics P-CHANNEL
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
-30 — — V
V
GS
= 0V, I
D
= -250
μA
Zero Gate Voltage Drain Current
I
DSS
—
—
-1
μA
V
DS
= -30V, V
GS
= 0V
Gate-Source Leakage
I
GSS
—
—
±100 nA
V
GS
= ±20V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
-1.0 — -2.0 V
V
DS
= V
GS
, I
D
= -250
μA
Static Drain-Source On-Resistance
R
DS (ON)
—
38 45
mΩ
V
GS
= -10V, I
D
= -5.2A
—
65 85
V
GS
= -4.5V, I
D
= -4A
Forward Transfer Admittance
|Y
fs
|
—
5 — S
V
DS
= -5V, I
D
= -5.2A
Diode Forward Voltage
V
SD
—
-0.7 -1.2 V V
GS
= 0V, I
S
= -1A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
C
iss
—
590 —
pF
V
DS
= -25V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance
C
oss
—
69 —
pF
Reverse Transfer Capacitance
C
rss
—
53 —
pF
Gate resistance
R
g
—
11 —
Ω
V
DS
= 0V, V
GS
= 0V, f = 1.0MHz
Total Gate Charge (V
GS
= 4.5V)
Q
g
—
5.1 —
nC
V
DS
= -15V, I
D
= -6A
Total Gate Charge (V
GS
= 10V)
Q
g
—
10.5 —
nC
Gate-Source Charge
Q
gs
—
1.8 —
nC
Gate-Drain Charge
Q
gd
—
1.9 —
nC
Turn-On Delay Time
t
D(on)
—
6.8 —
ns
V
DD
= -15V, V
GS
= -10V,
R
G
= 6
Ω, I
D
= -1A
Turn-On Rise Time
t
r
—
4.9 —
ns
Turn-Off Delay Time
t
D(off)
—
28.4 —
ns
Turn-Off Fall Time
t
f
—
12.4 —
ns
Reverse Recovery Time
t
rr
—
14 —
ns
I
F
= 12A, di/dt = 500A/
μs
Reverse Recovery Charge
Q
rr
—
11 —
nC
Notes:
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.