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Electrical characteristics - q2 p-channel – Diodes DMC2400UV User Manual

Page 6

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DMC2400UV

Document number: DS35537 Rev. 6 - 2

6 of 10

www.diodes.com

February 2012

© Diodes Incorporated

DMC2400UV

NEW PROD

UC

T

ADVAN

CE I

N

F

O

RM

ATI

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Electrical Characteristics - Q2 P-CHANNEL

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage

BV

DSS

-20 - - V

V

GS

= 0V, I

D

= -1mA

Zero Gate Voltage Drain Current T

J

= 25°C

I

DSS

- -

-100

nA

V

DS

= -20V, V

GS

= 0V

Gate-Source Leakage

I

GSS

- -

±1.0

μA

V

GS

= ±5V, V

DS

= 0V

- -

±5.0

V

GS

= ±8V, V

DS

= 0V

ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage

V

GS(th)

-0.5 - -1.0 V

V

DS

= V

GS

, I

D

= -250

μA

Static Drain-Source On-Resistance

R

DS (ON)

- 0.67

0.97

Ω

V

GS

= -5V, I

D

= -100mA

0.7

1.0

V

GS

= -4.5V, I

D

= -100mA

- 0.9 1.5

V

GS

= -2.5V, I

D

= -80mA

- 1.2 2.0

V

GS

= -1.8V, I

D

= -40mA

- 1.5 3.0

V

GS

= -1.5V, I

D

= -30mA

- 5 -

V

GS

= -1.2V, I

D

= -1mA

Forward Transfer Admittance

|Y

fs

|

- 0.7 - S

V

DS

= -3V, I

D

= -100mA

Diode Forward Voltage

V

SD

-

-0.75

-1.2

V

V

GS

= 0V, I

S

= -330mA,

DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance

C

iss

- 46.1 -

pF

V

DS

= 10V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

- 7.2 -

Reverse Transfer Capacitance

C

rss

- 4.9 -

Gate Resistance

R

g

- 14.3 -

Ω

V

DS

= 0V, V

GS

= 0V,

Total Gate Charge V

GS

= -4.5V

Q

g

- 0.5 -

nC

V

DS

= -10V, I

D

= -250mA

Total Gate Charge V

GS

= -10V

Q

g

- 0.85 -

Gate-Source Charge

Q

gs

- 0.09 -

Gate-Drain Charge

Q

gd

- 0.09 -

Turn-On Delay Time

t

D(on)

-

8.5

-

ns

V

DD

= -3V, V

GS

= -2.5V,

R

L

= 300

Ω, R

G

= 25

Ω,

I

D

= -100mA

Turn-On Rise Time

t

r

-

4.3

-

Turn-Off Delay Time

t

D(off)

-

20.2

-

Turn-Off Fall Time

t

f

-

19.2

-

Notes:

4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.




0

1

2

3

4

5

-V

, DRAIN -SOURCE VOLTAGE (V)

Fig. 13 Typical Output Characteristics

DS

-I

, D

R

AI

N

C

U

R

R

E

N

T

(A

)

D

0

0.2

0.4

0.6

0.8

1.0

0

1

2

3

4

-V

, GATE SOURCE VOLTAGE(V)

Fig. 14 Typical Transfer Characteristics

GS

-I

, D

R

AI

N

C

U

R

R

E

N

T

(A

)

D

0

0.2

0.4

0.6

0.8

1.0

T = 125 C

A

°