Dmg2307l new prod uc t, Maximum ratings, Thermal characteristics – Diodes DMG2307L User Manual
Page 2: Electrical characteristics, Dmg2307l

DMG2307L
Document number: DS35414 Rev. 3 – 2
2 of 6
www.diodes.com
November 2013
© Diodes Incorporated
DMG2307L
NEW PROD
UC
T
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Drain-Source Voltage
V
DSS
-30 V
Gate-Source Voltage
V
GSS
±20 V
Continuous Drain Current (Note 6) V
GS
= -10V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
-2.5
-2.0
A
Continuous Drain Current (Note 7) V
GS
= -10V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
-3.8
-3.0
A
Continuous Drain Current (Note 7) V
GS
= -10V
t ≦10sec
T
A
= +25°C
T
A
= +70°C
I
D
-4.6
-3.6
A
Continuous Drain Current (Note 7) V
GS
= -4.5V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
-3.1
-2.5
A
Pulsed Drain Current (Note 7)
I
DM
-20 A
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Total Power Dissipation (Note 6)
P
D
0.76 W
Thermal Resistance, Junction to Ambient (Note 6)
R
θJA
159 °C/W
Total Power Dissipation (Note 7)
P
D
1.36 W
Thermal Resistance, Junction to Ambient (Note 7)
R
θJA
94 °C/W
Total Power Dissipation (Note 7) t ≦ 10sec
P
D
1.9 W
Thermal Resistance, Junction to Ambient (Note 7) t ≦ 10sec
R
θJA
65.8 °C/W
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
BV
DSS
-30
–
– V
V
GS
= 0V, I
D
= -250μA
Zero Gate Voltage Drain Current @T
C
= +25°C
I
DSS
– –
-1.0
μA
V
DS
= -30V, V
GS
= 0V
Gate-Source Leakage
I
GSS
– –
±100 nA
V
GS
= ±20V, V
DS
= 0V
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
V
GS(th)
-1.0 – -3.0 V
V
DS
= V
GS
, I
D
= -250μA
Static Drain-Source On-Resistance
R
DS (ON)
–
70 90
mΩ
V
GS
= -10V, I
D
= -2.5A
–
105 134
V
GS
= -4.5V, I
D
= -2.5A
Forward Transfer Admittance
|Y
fs
|
–
4.8 – S
V
DS
= -10V, I
D
= -2.5A
Diode Forward Voltage (Note 7)
V
SD
–
-0.75 -1.0
V V
GS
= 0V, I
S
= -1A
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
C
iss
–
371.3
–
pF
V
DS
= -15V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance
C
oss
–
51.3
–
pF
Reverse Transfer Capacitance
C
rss
–
45.9
–
pF
Gate Resistance
R
g
–
17
–
Ω
V
DS
= 0V, V
GS
= 0V,f = 1.0MHz
Total Gate Charge (V
GS
= -4.5V)
Q
g
–
4.0
–
nC
V
GS
= -10V, V
DS
= -15V,
I
D
= -3A
Total Gate Charge (V
GS
= -10V)
Q
g
–
8.2
–
nC
Gate-Source Charge
Q
gs
–
0.9
–
nC
Gate-Drain Charge
Q
gd
–
1.2
–
nC
Turn-On Delay Time
t
D(on)
–
4.8
–
ns
V
DS
= -15V, V
GS
= -10V,
R
L
= 15Ω, R
G
= 6Ω,
I
D
= -1A
Turn-On Rise Time
t
r
–
7.3
–
ns
Turn-Off Delay Time
t
D(off)
–
22.4
–
ns
Turn-Off Fall Time
t
f
–
13.4
–
ns
Notes:
6. Device mounted on FR-4 PCB, with minimum recommended pad layout.
7. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.