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Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMP21D5UFB4 User Manual

Page 2

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DMP21D5UFB4

Document number: DS35284 Rev. 5 - 2

2 of 6

www.diodes.com

May 2012

© Diodes Incorporated

DMP21D5UFB4

ADVAN

CE I

N

F

O

RM

ATI

O

N




Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

-20 V

Gate-Source Voltage

V

GSS

±8 V

Continuous Drain Current (Note 6) V

GS

= -4.5V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

-700
-600

mA

t<10s

T

A

= 25°C

T

A

= 70°C

I

D

-850
-670

mA

Continuous Drain Current (Note 6) V

GS

= -1.8V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

-500
-400

mA

t<10s

T

A

= 25°C

T

A

= 70°C

I

D

-600
-550

mA

Pulsed Drain Current (10

μs pulse, duty cycle = 1%)

I

DM

-2 A

Maximum Body Diode continuous Current

I

S

-800 mA

Thermal Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 5)

P

D

0.46 W

Thermal Resistance, Junction to Ambient (Note 5)

Steady state

R

θJA

279 °C/W

t<10s 210

°C/W

Total Power Dissipation (Note 6)

P

D

0.95 W

Thermal Resistance, Junction to Ambient (Note 6)

Steady state

R

θJA

134 °C/W

t<10s 100

°C/W

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C

Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage

BV

DSS

-20 - - V

V

GS

= 0V, I

D

= -1mA

Zero Gate Voltage Drain Current T

J

= 25°C

I

DSS

- -

-100

nA

V

DS

= -20V, V

GS

= 0V

Gate-Source Leakage

I

GSS

- -

±1.0

μA

V

GS

= ±5V, V

DS

= 0V

- -

±5.0

V

GS

= ±8V, V

DS

= 0V

ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage

V

GS(th)

-0.5 - -1.0 V

V

DS

= V

GS

, I

D

= -250

μA

Static Drain-Source On-Resistance

R

DS (ON)

- 0.67

0.97

Ω

V

GS

= -5V, I

D

= -100mA

0.7

1.0

V

GS

= -4.5V, I

D

= -100mA

- 0.9 1.5

V

GS

= -2.5V, I

D

= -80mA

- 1.2 2.0

V

GS

= -1.8V, I

D

= -40mA

- 1.5 3.0

V

GS

= -1.5V, I

D

= -30mA

- 5 -

V

GS

= -1.2V, I

D

= -1mA

Forward Transfer Admittance

|Y

fs

|

- 0.7 - S

V

DS

= -3V, I

D

= -100mA

Diode Forward Voltage

V

SD

-

-0.75

-1.2

V

V

GS

= 0V, I

S

= -330mA,

DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance

C

iss

- 46.1 -

pF

V

DS

= 10V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

- 7.2 -

Reverse Transfer Capacitance

C

rss

- 4.9 -

Gate Resistance

R

g

- 14.3 -

Ω

V

DS

= 0V, V

GS

= 0V, f = 1.0MHz

Total Gate Charge V

GS

= -4.5V

Q

g

- 0.5 -

nC

V

DS

= -10V, I

D

= -250mA

Gate-Source Charge

Q

gs

- 0.09 -

Gate-Drain Charge

Q

gd

- 0.09 -

Turn-On Delay Time

t

D(on)

-

8.5

-

ns

V

DD

= -3V, V

GS

= -2.5V,

R

L

= 300

Ω, R

G

= 25

Ω,

I

D

= -100mA

Turn-On Rise Time

t

r

-

4.3

-

Turn-Off Delay Time

t

D(off)

-

20.2

-

Turn-Off Fall Time

t

f

-

19.2

-

Notes:

5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.