Diodes DMP2160UFDB - Manual (Page 2)

DMP2160UFDB
Document number: DS31643 Rev. 6 - 2
2 of 6
www.diodes.com
November 2012
© Diodes Incorporated
DMP2160UFDB
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage V
DSS
-20 V
Gate-Source Voltage V
GSS
±12 V
Drain Current (Note 5) I
D
-3.8 A
Pulsed Drain Current (Note 6) I
DM
-13 A
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Power Dissipation (Note 5) P
D
1.4 W
Thermal Resistance, Junction to Ambient R θJA 89 °C/W
Operating and Storage Temperature Range T J , T STG
-55 to +150 °C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7
Drain-Source Breakdown Voltage
BV
DSS
-20 ⎯ ⎯ V V
GS
= 0V, I
D
= -250
μA
Zero Gate Voltage Drain Current I
DSS
⎯ ⎯ -1 μA V
DS
= -20V, V
GS
= 0V
Gate-Source Leakage I
GSS
⎯
⎯ ⎯
⎯ ±100
±800
nA
V
GS
= ±8V, V
DS
= 0V
V
GS
= ±12V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
-0.45 ⎯ -0.9 V V
DS
= V
GS
, I
D
= -250 μA
Static Drain-Source On-Resistance R
DS (ON)
⎯
⎯
⎯
54
68
86 70
85
⎯
m
Ω
V GS = -4.5V, I D = -2.8A
V
GS
= -2.5V, I
D
= -2.0A
V
GS
= -1.8V, I
D
= -1.0A
Forward Transfer Admittance |Y
fs
| ⎯ 8 ⎯ S V
DS
= -5V, I
D
= -2.8A
Diode Forward Voltage (Note 7) V SD
⎯ 0.7 -1.2 V V
GS = 0V, I S = -1.6A
DYNAMIC CHARACTERISTICS
Input Capacitance
C
iss
⎯ 536 ⎯ pF
V
DS
= -10V, V
GS
= 0V
f = 1.0MHz
Output Capacitance C oss
⎯ 68 ⎯ pF
Reverse Transfer Capacitance C
rss
⎯ 59 ⎯ pF
Gate Resistance R
g
- 8.72 - Ω V
DS
= 0V, V
GS
= 0V, f = 1MHz
Total Gate Charge Q g
- 6.5 - nC
V
GS
= -4.5V, V
DD
= -10V,
I
D
= -1.5A
Gate-Source Charge Q
gs
- 0.8 - nC
Gate-Drain Charge Q
gd
- 1.4 - nC
Turn-On Delay Time t
D(on)
- 11.51 - ns
V
GEN
= -4.5V, V
DD
= -10V,
R L = 10 Ω, R
G = 6 Ω
Turn-On Rise Time t
r
- 12.09 - ns
Turn-Off Delay Time t
D(off)
- 55.34 - ns
Turn-Off Fall Time t
f
- 27.54 - ns
Notes: 5. Device mounted on FR-4 PCB, on minimum recommended, 2oz Copper pad layout.
6. Repetitive rating, pulse width limited by junction temperature.
7. Short duration pulse test used to minimize self-heating effect.