Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMG4800LK3 User Manual
Page 2

DMG4800LK3
Document number: DS31959 Rev. 3 - 2
2 of 6
November 2012
© Diodes Incorporated
DMG4800LK3
NEW PROD
UC
T
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Drain-Source Voltage
V
DSS
30 V
Gate-Source Voltage
V
GSS
±25 V
Continuous Drain Current (Note 5)
Steady
State
T
A
= +25°C
T
A
= +85°C
I
D
10.0
6.5
A
Pulsed Drain Current (Note 6)
I
DM
48 A
Thermal Characteristics
Characteristic Symbol
Value
Unit
Power Dissipation (Note 5)
P
D
1.71 W
Thermal Resistance, Junction to Ambient @T
A
= +25°C
R
θJA
72.9 °C/W
Operating and Storage Temperature Range
T
J
, T
STG
-55 to +150
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
30 - - V
V
GS
= 0V, I
D
= 250
μA
Zero Gate Voltage Drain Current T
J
= +25°C
I
DSS
- -
1.0
μA
V
DS
= 30V, V
GS
= 0V
Gate-Source Leakage
I
GSS
- -
±100
nA
V
GS
= ±20V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
0.8 - 1.6 V
V
DS
= V
GS
, I
D
= 250
μA
Static Drain-Source On-Resistance
R
DS (ON)
-
12
16
17
24
m
Ω
V
GS
= 10V, I
D
= 9A
V
GS
= 4.5V, I
D
= 7A
Forward Transfer Admittance
|Y
fs
|
- 10 - S
V
DS
= 10V, I
D
= 9A
Diode Forward Voltage
V
SD
- 0.7
1.0 V
V
GS
= 0V, I
S
= 1A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
C
iss
-
798
-
pF
V
DS
= 10V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance
C
oss
-
128
-
pF
Reverse Transfer Capacitance
C
rss
-
122
-
pF
Gate Resistance
R
g
-
1.37
-
Ω
V
DS
= 0V, V
GS
= 0V, f = 1MHz
Total Gate Charge
Q
g
-
8.7
-
nC
V
GS
= 5V, V
DS
= 15V,
I
D
= 9A
Gate-Source Charge
Q
gs
-
1.7
-
nC
Gate-Drain Charge
Q
gd
-
2.4
-
nC
Turn-On Delay Time
t
D(on)
-
5.03
-
ns
V
DD
= 15V, V
GS
= 10V,
R
L
= 15
Ω, R
G
= 6
Ω, I
D
= 1A
Turn-On Rise Time
t
r
-
4.50
-
ns
Turn-Off Delay Time
t
D(off)
-
26.33
-
ns
Turn-Off Fall Time
t
f
-
8.55
-
ns
Notes:
5. Device mounted on FR-4 PCB, with minimum recommended pad layout.
6. Repetitive rating, pulse width limited by junction temperature.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.