Diodes DDTD (xxxx) C User Manual
Features, Mechanical data, Maximum ratings

DDTD (xxxx) C
Document number: DS30384 Rev. 10 - 2
1 of 4
www.diodes.com
January 2009
© Diodes Incorporated
DDTD (xxxx) C
NPN PRE-BIASED 500mA SURFACE MOUNT TRANSISTOR
Features
•
Epitaxial Planar Die Construction
•
Complementary PNP Types Available (DDTB)
•
Built-In Biasing Resistors, R1, R2
•
Lead, Halogen and Antimony Free, RoHS Compliant
•
"Green" Device (Notes 2 and 3)
Part Number
R1 (NOM)
R2 (NOM)
Marking
DDTD113EC 1K
1K
N60
DDTD123EC 2.2K
2.2K
N61
DDTD143EC 4.7K
4.7K
N62
DDTD114EC 10K
10K
N63
DDTD122JC 0.22K
4.7K
N64
DDTD113ZC 1K
10K
N65
DDTD123YC 2.2K
10K
N66
DDTD133HC 3.3K
10K
N67
DDTD123TC 2.2K
OPEN
N69
DDTD143TC 4.7K
OPEN
N70
DDTD114TC 10K
OPEN
N71
DDTD114GC 0
10K
N72
Mechanical Data
• Case:
SOT-23
•
Case Material: Molded Plastic, “Green” Molding Compound,
Note 3. UL Flammability Classification Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminal Connections: See Diagram
•
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating) Solderable per MIL-STD-202, Method 208
•
Marking Information: See Table and Page 3
•
Ordering Information: See Page 3
•
Weight: 0.008 grams (approximate)
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Supply Voltage, (3) to (2)
V
CC
50
V
Input Voltage, (1) to (2)
DDTD113EC
DDTD123EC
DDTD143EC
DDTD114EC
DDTD122JC
DDTD113ZC
DDTD123YC
DDTD133HC
V
IN
-10 to +10
-10 to +12
-10 to +30
-10 to +40
-5 to +5
-5 to +10
-5 to +12
-6 to +20
V
Input Voltage, (2) to (1)
DDTD123TC
DDTD143TC
DDTD114TC
DDTD114GC
V
EBO(MAX)
5
V
Output
Current
All
I
C
500
mA
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation
P
D
200
mW
Thermal Resistance, Junction to Ambient Air (Note 1)
R
θJA
625
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-55 to +150
°C
Notes:
1. Mounted on FR4 PC Board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead. Halogen and Antimony Free.
3. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
Top View
Package Pin Out Configuration
R1
OUT
B
C
E
R2
3
2
1
IN
GND(0)