Diodes AL3159 - Manual (Page 3)

AL3159
HIGH EFFICIENCY 1x/2x CHARGE PUMP
FOR WHITE LED APPLICATIONS
AL3159
Document number: DS35048 Rev. 2 - 2
3 of 10
www.diodes.com
January 2011
© Diodes Incorporated
NEW PROD
UC
T
Absolute Maximum Ratings (Note 2)
Symbol Description Rating Unit
ESD HBM Human Body Model ESD Protection 2 KV
ESD MM Machine Model ESD Protection 200 V
V
IN
Input Voltage -0.3 to 6 V
V
CTL1,2,3
CTL1, CTL2, CTL3 to GND Voltage -0.3 to V
IN
+0.3 V
I
OUT
Maximum DC Output Current 270 mA
T
J
Operating Junction Temperature Range 150
°C
T
LEAD
Maximum Soldering Temperature (at leads, 10 sec) 300 °C
Notes: 2. Exceeding Absolute Maximum Ratings will cause permanent damage to the device.
Recommended Operating Conditions
Symbol Parameter Min Max Unit
V
IN
Input Voltage 2.7 5.5 V
T
A
Operating Ambient Temperature -40 85 °C
Electrical Characteristics (T
A
= 25
°C, V
IN
= 3.6V, C
IN
= C
OUT
= 2.2µF, C
1
= 1µF Unless otherwise noted)
Symbol Parameter Test Conditions Min Typ. Max Unit
I
Q
Quiescent Current
1x Mode, 3.0≤V
IN
≤5.5, Active,
No Load Current
0.3 0.6
mA
2x Mode, 3.0≤V
IN
≤5.5, Active,
No Load Current
2 5
I
SHDN
Shutdown Current CTL1, CTL2 and CTL3 = 0 1 µA
I
DX
I
SINK
Current Accuracy (Note 3) 19 20 21 mA
I
D-Match
Current Matching Between Any Two
Current Sink Inputs (Note 4)
V
F
: D1:D9 = 3.6V 1 2 %
R
out
Open Loop V
OUT
Resistance
1x mode 0.5
Ω
2 x mode 4.5
V
TH
1x to 2x Transition Threshold at Any
I
SINK
Pin
I
DX
= 20mA 150 mV
V
HS
Mode Transition Hysteresis 250 mV
T
SS
Soft-Start Time 100 µs
Fsw Switching Frequency 1.2 MHz
V
CTL1, 2,3 (L)
CTL1,2,3 Threshold Low V
IN
= 2.7V 0.4 V
V
CTL1,2,3(H)
CTL1,2,3 Threshold High V
IN
= 5.5V 1.4 V
T
CTL1,2,3
CTL1,2,3 Off Timeout 200 µs
UVLO V
IN
Under-Voltage Lockout 1.8 2 2.2 V
I
CTL1,2,3
CTL1,2,3 Input Leakage -1 1 µA
T
SHDN
Thermal shutdown Protection 160 °C
T
HYS
Thermal shutdown hysteresis 10 °C
θ
JA
Thermal Resistance Junction-to-
Ambient
QFN3030-20 (Note 5) 48 o C/W
Notes: 3. Determined by the average current levels of all active channels
4. Defined as the deviation of any sink current from the average of all active current channels.
5. Device mounted on FR-4 substrate, 2"*2", 2oz copper, double-sided PC board, with minimum recommended pad on top layer and
4 vias to bottom layer.