Diodes AP2172 - Manual (Page 5)

AP2162/AP2172
1A DUAL CHANNEL CURRENT-LIMITED POWER
SWITCH
AP2162/AP2172 Rev. 5 5 of 17 FEBRUARY 2009
www.diodes.com © Diodes Incorporated
Electrical Characteristics
(T
A
= 25
o
C, V
IN
= +5.0V, unless otherwise stated)
Symbol Parameter Test Conditions Min Typ. Max Unit
V
UVLO
Input UVLO R
load
=1k Ω 1.6 1.9 2.5 V
I
SHDN
Input Shutdown Current Disabled, I
OUT
= 0 0.5 1 μA
I
Q
Input Quiescent Current, Dual Enabled, I
OUT
= 0 100 160 μA
I
LEAK
Input Leakage Current Disabled, OUT grounded 1 μA
I
REV
Reverse Leakage Current Disabled, V
IN
= 0V, V
OUT
= 5V, I
REV
at V
IN
1 μA
R
DS(ON)
Switch on-resistance
V
IN
= 5V, I
OUT
= 0.5A,
-40 o C ≤ T
A
≤85 o C
MSOP-8L-EP 115 150 m Ω
SOP-8L 120 160 m Ω
V
IN
= 3.3V, I
OUT
= 0.5A, -40
o
C ≤ T
A
≤85 o
C 140 180 m Ω
I
SHORT
Short-circuit current limit Enabled into short circuit, C
L
=68
μF 1.4 A
I
LIMIT
Over-Load Current Limit
V
IN
= 5V, V
OUT
= 4.6V, C
L
=68
μF, -40 o
C ≤
T
A
≤85 o
C
1.1 1.5 1.9 A
I
Trig
Current limiting trigger
threshold V
IN
= V
EN
, Output Current Slew rate
(<100A/s), C
L
=68
μF
2.4 A
V
IL
EN Input Logic Low Voltage V
IN
= 2.7V to 5.5V 0.8 V
V
IH
EN Input Logic High Voltage V
IN
= 2.7V to 5.5V 2 V
I
SINK
EN Input leakage V
EN
= 5V 1
μA
T
D(ON)
Output turn-on delay time C
L
=1
μF, R
load
=10 Ω 0.05 ms
T
R
Output turn-on rise time C
L
=1
μF, R
load
=10 Ω 0.6 1.5 ms
T
D(OFF)
Output turn-off delay time C
L
=1
μF, R
load
=10 Ω 0.01 ms
T
F
Output turn-off fall time C
L
=1
μF, R
load
=10 Ω 0.05 0.1 ms
R
FLG
FLG output FET on-resistance I
FLG
=10mA 30 50 Ω
T
Blank
FLG blanking time C
IN
=10
μF, C
L
=68
μF
4 7 15 ms
T
SHDN
Thermal shutdown threshold Enabled, R
load
=1k Ω 140
°C
T
HYS
Thermal shutdown hysteresis 25 °C
θ
JA
Thermal Resistance
Junction-to-Ambient
SOP-8L (Note 4) 110 o C/W
MSOP-8L-EP (Note 5) 60 o C/W
Notes: 4. Test condition for SOP-8L: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout.
5. Test condition for MSOP-8L-EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3
vias to bottom layer ground plane.