Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes D5V0X1B2LP3 User Manual
Page 2
D5V0X1B2LP3
Document number: DS36494 Rev. 3 - 2
2 of 5
May 2014
© Diodes Incorporated
D5V0X1B2LP3
ADVAN
CE I
N
F
O
RM
ATI
O
N
ADVANCED INFORMATION
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Unit
Conditions
Peak Pulse Current
I
PP
1.5
A
8/20µs, per Figure 3
ESD Protection – Contact Discharge
V
ESD_Contact
±15
kV
IEC 61000-4-2 Standard
ESD Protection – Air Discharge
V
ESD_Air
±15
kV
IEC 61000-4-2 Standard
Thermal Characteristics
Characteristic Symbol
Value
Unit
Package Power Dissipation (Note 5)
P
D
250 mW
Thermal Resistance, Junction to Ambient (Note 5)
R
θJA
500
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +150
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Conditions
Reverse Standoff Voltage
V
RWM
— — 5.5 V
—
Channel Leakage Current (Note 6)
I
RM
— — 100 nA
V
RWM
= 5.0V
Breakdown Voltage
V
BR
7.0 — — V
I
R
= 1mA
Clamping Voltage
V
CL
—
— 14 V
I
PP
= 1A, t
p
= 8/20µs
Channel Input Capacitance
C
T
—
0.23 0.4 pF
V
R
= 2.5V, f = 1MHz
— 0.3 — pF
V
R
= 0V, f = 1MHz
Notes:
5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at
6. Short duration pulse test used to minimize self-heating effect.
P
, P
O
WE
R
DI
SSI
P
A
T
IO
N
(mW
)
D
T , AMBIENT TEMPERATURE (°C)
Figure 1 Power Derating Curve
A
25
50
75
100
125
150
0
175
0
25
50
75
100
125
150
175
200
225
250
Note 5
0
50
25
50
75
100 125
150
P
EAK
P
U
LS
E
D
E
R
A
T
IN
G
%
O
F
PE
AK P
O
W
E
R OR
CURRENT
T , AMBIENT TEMPERATURE (°C)
Figure 2 Pulse Derating Curve
A
0
100
25
75
175 200