Package outline dimensions – Diodes 1N4448WSF User Manual
Page 3
1N4448WSF
Document number: DS35380 Rev. 3 - 2
3 of 4
August 2011
© Diodes Incorporated
1N4448WSF
NEW PROD
UC
T
0
200
0
25
50
75
100
125
150
P
P
O
WE
R
DI
SSI
P
A
T
IO
N
(mW
)
D
,
T , AMBIENT TEMPERATURE ( C)
Fig. 1 Forward Current Derating Curve
A
°
400
Note 4
500
300
100
0.0001
0.001
0.01
0.1
1
0
0.4
0.8
1.2
1.6
V , INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
F
I
, INS
T
AN
T
ANE
O
U
S F
O
R
WA
R
D
C
U
R
R
EN
T
(A
)
F
V , INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics
R
I
, INS
T
AN
T
ANE
O
U
S
R
EVE
R
SE
C
U
R
R
EN
T
(A
)
R
μ
0.001
0.01
0.1
1
10
100
0
10
20
30
40
50
60
70
80
90 100
T = 25 C
°
A
T =
C
°
A
-55
T = 5 C
°
A
8
T = 25 C
°
A
1
T =
C
°
A
150
V , DC REVERSE VOLTAGE (V)
Fig. 4 Total Capacitance vs. Reverse Voltage
R
C
,
T
O
T
AL
C
A
P
A
C
IT
A
N
C
E (
p
F)
T
0
0.5
1
1.5
1
10
f = 1MHz
40
Package Outline Dimensions
SOD323F
Dim Min Max Typ
A
0.60 0.75
−
b
0.25 0.35
−
c
0.05 0.26
−
D
1.15 1.35 1.25
E
1.60 1.80 1.70
He
2.30 2.70 2.50
L1
0.30 0.50 0.40
α1
−
−
7°
α2
−
−
3°
β1
−
−
7°
β2
−
−
3°
All Dimensions in mm
A
He
E
D
b (2x)
c
L1
β2
β1
α2
α1