Maximum ratings, Thermal characteristics – Diodes ZXMS6004SG User Manual
Page 3
IntelliFET
®
is a registered trademark of Diodes Incorporated
ZXMS6004SG
Document number: DS32247 Rev. 1 - 2
3 of 9
April 2014
© Diodes Incorporated
ZXMS6004SG
ADVAN
CE I
N
F
O
RM
ATI
O
N
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Continuous Drain-Source Voltage
V
DS
60 V
Drain-Source Voltage for Short Circuit Protection
V
DS(SC)
36 V
Continuous Input Voltage
V
IN
-0.5 to +6
V
Continuous Input Current @-0.2V ≤ V
IN
≤ 6V
Continuous Input Current @V
IN
< -0.2V or V
IN
> 6V
I
IN
No limit
│I
IN
│≤2
mA
Pulsed Drain Current @V
IN
= 3.3V
I
DM
2 A
Pulsed Drain Current @V
IN
= 5V
I
DM
2.5 A
Continuous Source Current (Body Diode) (Note 5)
I
S
1 A
Pulsed Source Current (Body Diode)
I
SM
5 A
Unclamped Single Pulse Inductive Energy,
T
J
= 25
C, I
D
= 0.5A, V
DD
= 24V
E
AS
480 mJ
Electrostatic Discharge (Human Body Model)
V
ESD
4000 V
Charged Device Model
V
CDM
1000 V
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Power Dissipation at T
A
= +25
C (Note 5)
Linear Derating Factor
P
D
1.0
8.0
W
mW/
C
Power Dissipation at T
A
= +25
C (Note 6)
Linear Derating Factor
P
D
1.6
12.8
W
mW/
C
Thermal Resistance, Junction to Ambient (Note 5)
R
θJA
125
C/W
Thermal Resistance, Junction to Ambient (Note 6)
R
θJA
83
C/W
Thermal Resistance, Junction to Case (Note 7)
R
θJC
39
C/W
Operating Temperature Range
T
J
-40 to +150
C
Storage Temperature Range
T
STG
-55 to +150
C
Notes:
5. For a device surface mounted on 15mm x 15mm single sided 1oz weight copper on 1.6mm FR4 board, in still air conditions.
6. For a device surface mounted on 50mm x 50mm single sided 2oz weight copper on 1.6mm FR4 board, in still air conditions.
7. Thermal resistance between junction and the mounting surfaces of drain and source pins.