Zxmp10a17k, Maximum ratings, Thermal characteristics – Diodes ZXMP10A17K User Manual
Page 2

ZXMP10A17K
Document Number DS32028 Rev. 5 - 2
2 of 8
April 2014
© Diodes Incorporated
ZXMP10A17K
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Unit
Drain-Source Voltage
V
DSS
-100 V
Gate-Source Voltage
V
GS
±20
V
Continuous Drain current
V
GS
= 10V
(Note 6)
I
D
-3.9
A
T
A
= +70°C (Note 6)
-3.1
(Note 5)
-2.4
Pulsed Drain current
V
GS
= 10V
(Note 7)
I
DM
-11.3 A
Continuous Source Current (Body diode)
(Note 6)
I
S
-8.7 A
Pulsed Source Current (Body diode)
(Note 7)
I
SM
-11.3 A
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Unit
Power dissipation
Linear derating factor
(Note 5)
P
D
4.0
32.0
W
mW/
°C
(Note 6)
10.2
80.8
(Note 9)
2.0
16.1
Thermal Resistance, Junction to Ambient
(Note 5)
R
θJA
31
°C/W
(Note 6)
12.3
(Note 9)
62
Thermal Resistance, Junction to Case
(Note 8)
R
θJL
2.4
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-55 to 150
°C
Notes:
5. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
6. Same as note (1), except the device is measured at t
≤ 10 sec.
7. Same as note (1), except the device is pulsed with D= 0.02 and pulse width 300µs. The pulse current is limited by the maximum junction temperature.
8. Thermal resistance from junction to solder-point (at the end of the drain lead).
9. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.