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Zxmp10a17k, Maximum ratings, Thermal characteristics – Diodes ZXMP10A17K User Manual

Page 2

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ZXMP10A17K

Document Number DS32028 Rev. 5 - 2

2 of 8

www.diodes.com

April 2014

© Diodes Incorporated

ZXMP10A17K




Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Unit

Drain-Source Voltage

V

DSS

-100 V

Gate-Source Voltage

V

GS

±20

V

Continuous Drain current

V

GS

= 10V

(Note 6)

I

D

-3.9

A

T

A

= +70°C (Note 6)

-3.1

(Note 5)

-2.4

Pulsed Drain current

V

GS

= 10V

(Note 7)

I

DM

-11.3 A

Continuous Source Current (Body diode)

(Note 6)

I

S

-8.7 A

Pulsed Source Current (Body diode)

(Note 7)

I

SM

-11.3 A


Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Unit

Power dissipation
Linear derating factor

(Note 5)

P

D

4.0

32.0

W

mW/

°C

(Note 6)

10.2
80.8

(Note 9)

2.0

16.1

Thermal Resistance, Junction to Ambient

(Note 5)

R

θJA

31

°C/W

(Note 6)

12.3

(Note 9)

62

Thermal Resistance, Junction to Case

(Note 8)

R

θJL

2.4

°C/W

Operating and Storage Temperature Range

T

J

, T

STG

-55 to 150

°C

Notes:

5. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions; the device is

measured when operating in a steady-state condition.
6. Same as note (1), except the device is measured at t

≤ 10 sec.

7. Same as note (1), except the device is pulsed with D= 0.02 and pulse width 300µs. The pulse current is limited by the maximum junction temperature.
8. Thermal resistance from junction to solder-point (at the end of the drain lead).
9. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is

measured when operating in a steady-state condition.