Diodes ZXMP6A16K - Manual (Page 2)

ZXMP6A16K
Issue 3 - June 2007 2 www.zetex.com
© Zetex Semiconductors plc 2007
Absolute maximum ratings
NOTES:
(a) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in
still air conditions.
(b) For a device surface mounted on FR4 PCB measured at t
Յ
10 sec.
(c) Repetitive rating 50mm x 50mm x 1.6mm FR4 PCB, D=0.02 pulse width=300
␮
s - pulse width limited by maximum
junction temperature.
(d) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in
still air conditions.
Parameter Symbol Limit Unit
Drain-source voltage V
DSS
-60 V
Gate-source voltage V
GS
± 20 V
Continuous drain current @ V
GS
= 10V; T
amb
=25°C
(b) I
D
8.2 A
@ V
GS
= 10V; T
amb
=70°C
(b) 6.5
@ V
GS
= 10V; T
amb
=25°C
(a) 5.4
Pulsed drain current
(c) I
DM
27.2 A
Continuous source current (body diode)
(b) I
S
10 A
Pulsed source current (body diode)
(c) I
SM
27.2 A
Power dissipation at T
amb
=25°C
(a) P
D
4.24 W
Linear derating factor 33.9 mW/°C
Power dissipation at T
amb
=25°C
(b) P
D
9.76 W
Linear derating factor 78 mW/°C
Power dissipation at T
amb
=25°C
(d) P
D
2.11 W
Linear derating factor 16.8 mW/°C
Operating and storage temperature range T
j
, T
stg
-55 to +150 °C
Thermal resistance
Parameter Symbol Limit Unit
Junction to ambient
(a) R ⍜JA 29.45 °C/W
Junction to ambient
(b) R ⍜JA 12.8 °C/W
Junction to ambient
(d) R ⍜JA 59.1 °C/W