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Intel, Q35 express chipset, Vpro™ technology – Asus P5E-VM DO User Manual

Page 15: Serial ata 3.0 gb/s technology

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ASUS P5E-VM DO

1-3

Intel

®

Q35 Express Chipset

The Intel

®

Q35 Express Chipset is the latest chipset designed to support Intel

®

next generation 45nm CPU, 8GB of dual-channel DDR2 800/667 architecture,

1333/1066/800 FSB (Front Side Bus), PCI Express x16 graphics and multi-core

CPU.

Intel

®

vPro™ Technology

The Intel

®

vPro

Technology allows IT organizations to remotely manage corporate

PCs, even when they are powered off or with non-functional operating systems.

It features the Intel

®

Active Management Technology and offers IT organizations

a lighter-weight form of virtualization to audit all Intel

®

AMT-based platforms in

a network environment. PCs with Intel

®

vPro

Technology allow IT departments

to remotely retrieve assets and hardware/software inventories, contain security

threats, resolve system problems, and increase the uptime of desktops with lower

maintenance costs. To enable the Intel

®

vPro

Technology, first enable the related

vPro

Technology settings.

DDR2 memory support

The motherboard supports DDR2 memory that features data transfer rates of

800/667 MHz to meet the higher bandwidth requirements of the latest 3D graphics,

multimedia, and Internet applications. The dual-channel DDR2 architecture doubles

the bandwidth of your system memory to boost system performance, eliminating

bottlenecks with peak bandwidths of up to 12.8 GB/s. Without restriction to the

memory size across the two channels, the motherboard allows you to install DIMMs

with different memory size and enjoy dual-channel feature at the same time. See

page 1-19 for details.

Serial ATA 3.0 Gb/s technology

This motherboard supports the next-generation hard drives based on the Serial

ATA (SATA) 3Gb/s storage specification, delivering enhanced scalability and

doubling the bus bandwidth for high-speed data retrieval and saves. Easily backup

photos, videos and other entertainment contents to external devices. See page

1-33 for details.

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