Asus P8H61-M LX3 R2.0 - Manual (Page 8)

viii
P8H61-M LX3 R2.0 Series specifications summary
(continued on the next page)
CPU LGA1155 socket for Intel ® 3rd/2nd Generation Core™ i7 / Core™
i5 / Core™ i3 / Pentium ® / Celeron ® processors
Supports Intel 22nm CPU
Supports Intel ® Turbo Boost Technology 2.0
* The Intel ® Turbo Boost Technology 2.0 support depends on the
CPU types.
** Refer to www.asus.com for Intel ® CPU support list.
Chipset Intel ® H61 Express Chipset
Memory 2 x DIMMs, max. 16GB, DDR3 2200 (O.C.) / 2133 (O.C.) / 2000
(O.C.) / 1866 (O.C.) / 1600 / 1333 / 1066 MHz, non-ECC, un-
buffered memory
Dual-channel memory architecture
* DDR3 1600 MHz and higher memory frequency is supported by
Intel ® 3rd generation processors.
** Refer to www.asus.com for the latest Memory QVL (Qualified
Vendors List).
*** When you install a total memory of 4GB capacity or more,
Windows ® 32-bit operating system may only recognize less than
3GB. We recommend a maximum of 3GB system memory if you
are using a Windows ® 32-bit operating system.
Expansion slots 1 x PCI Express 3.0*/2.0 x16 slot with latch
2 x PCI Express 2.0 x1 slots
* PCIe 3.0 speed is supported by Intel ® 3rd generation Core™
processors.
Graphics Supports D-Sub with max. resolution of 2048 x 1536 @75Hz
Max. UMA Memory: 1748MB
Storage
Intel ® H61 Express Chipset:
- 4 x Serial ATA 3.0 Gb/s connectors
LAN Realtek ® 8111F PCIe Gigabit LAN controller
Audio VIA ® VT1708S 8-channel* High Definition Audio CODEC
- Supports Multi-Streaming
* Use a chassis with HD audio module in the front panel to
support an 8-channel audio output.
USB 10 x USB 2.0/1.1 ports (6 ports at the mid-board, 4 ports at the back
panel)
Other features 100% All High-quality Conductive Polymer Capacitors
(P8H61-M LX3 PLUS R2.0 only)