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Q-tech, Qt78 series, Thermal characteristics – Q-Tech QT78 User Manual

Page 5: Figure 1) (figure 2)

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Q-TECH Corporation - 10150 W. Jefferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-tech.com

QT78 SERIES

HIGH RELIABILITY MINIATURE CRYSTAL CLOCK OSCILLATORS

1.8 to 5.0Vdc - 15kHz to 150MHz

Q-TECH

CORPORATION

QT78 (Revision H, January 2011) (ECO #10085)

Vdd

GND

0.1xVdd

0.9xVdd

VOH

VOL

Tr

Tf

TH

T

0.5xVdd

SYMMETRY = x 100%

TH

T

Output Waveform (Typical)

Frequency vs. Temperature Curve

Test Circuit

-

-

Output

Ground

4

3

2

0.1µF

15pF

1

Tristate Function

Power

supply

10k

mA

Vdc

+

+

+

(*)

or

0.01µF

QT78

(*) CL includes probe and jig capacitance

Typical test circuit for CMOS logic

Frequency-Temperature Curves QT78RD-70MHz 1.8Vdc

-40

-30

-20

-10

10

20

30

40

-55 -50 -45 -40 -35 -30 -25 -20 -15 -10

-5

0

5

10

15

20

25

30

35

Temp (ºC)

P

P

M

40

45

50

55

60

65

70

75

80

85

90

95

100 105 110 115 120 125

0

45º

45º

Hybrid Case

Substrate

Die

D/A epoxy

D/A epoxy

Heat

Die

R1

D/A epoxy

Substrate

D/A epoxy

Hybrid Case

R2

R3

R4

R5

Thermal Characteristics

JA

JC

CA

Die

T

T

T

C

A

J

CA

JC

(Figure 1)

(Figure 2)

The Tristate function on pin 1 has a built-in pull-up resistor typical 50kΩ, so it can
be left floating or tied to Vdd without deteriorating the electrical performance.

The heat transfer model in a hybrid package is described in

figure 1.

Heat spreading occurs when heat flows into a material layer of

increased cross-sectional area. It is adequate to assume that

spreading occurs at a 45° angle.

The total thermal resistance is calculated by summing the

thermal resistances of each material in the thermal path

between the device and hybrid case.

RT = R1 + R2 + R3 + R4 + R5

The total thermal resistance RT (see figure 2) between the heat

source (die) to the hybrid case is the Theta Junction to Case

(Theta JC) in°C/W.

• Theta junction to case (Theta JC) for this product is 30°C/W.
• Theta case to ambient (Theta CA) for this part is 100°C/W.
• Theta Junction to ambient (Theta JA) is 130°C/W.

Maximum power dissipation PD for this package at 25°C is:
• PD(max) = (TJ (max) – TA)/Theta JA
• With TJ = 175°C (Maximum junction temperature of die)
• PD(max) = (175 – 25)/130 = 1.15W