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Q-tech, 5 of 7, Start up time – Q-Tech QT488 User Manual

Page 5: Thermal characteristics

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5 of 7

Q-TECH Corporation - 10150 W. Jefferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-tech.com

QT481 AND QT488 SERIES

ULTRA-LOW CURRENT REAL TIME CLOCK OSCILLATORS

2.5Vdc and 3.3Vdc - 32.768kHz

Q-TECH

CORPORATION

QPDS-0008 (Revision A, June 2013) (ECO # 10907)

Output Waveform (Typical)

Frequency vs. Temperature Curve

Test Circuit

-

-

Output

Ground

4

3

2

0.1µF

15pF

1

Tristate Function

Power

supply

10k

mA

Vdc

+

+

+

(*)

or

0.01µF

QT88

(*) CL includes probe and jig capacitance

Typical test circuit for CMOS logic

The Tristate function on pin 1 has a built-in pull-up resistor typical 50kΩ, so it can

be left floating or tied to Vdd without deteriorating the electrical performance.

-250

-200

-150

-100

-50

0

50

100

150

200

250

0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200

Frequency Stability (PPM)

Temperature (°C)

Type: QT88LD8M Vcc Input:3.3 Out Freq:32.768Khz +/-250ppm@ 0 to 200 deg.C

Start up Time

45º

45º

Hybrid Case

Substrate

Die

D/A epoxy

D/A epoxy

Heat

Die

R1

D/A epoxy

Substrate

D/A epoxy

Hybrid Case

R2

R3

R4

R5

Thermal Characteristics

JA

JC

CA

Die

T

T

T

C

A

J

CA

JC

(Figure 1)

(Figure 2)

The heat transfer model in a hybrid package is described in figure 1.
Heat spreading occurs when heat flows into a material layer of increased

cross-sectional area. It is adequate to assume that spreading occurs at a

45° angle.
The total thermal resistance is calculated by summing the thermal

resistances of each material in the thermal path between the device and

hybrid case.

RT = R1 + R2 + R3 + R4 + R5

The total thermal resistance RT (see figure 2) between the heat source

(die) to the hybrid case is the Theta Junction to Case (Theta JC) in°C/W.
• Theta junction to case (Theta JC) for this product is 30°C/W.

• Theta case to ambient (Theta CA) for this part is 100°C/W.

• Theta Junction to ambient (Theta JA) is 130°C/W.

Maximum power dissipation PD for this package at 25°C is:

• PD(max) = (TJ (max) – TA)/Theta JA

• With TJ = 175°C (Maximum junction temperature of die)

• PD(max) = (175 – 25)/130 = 1.15W