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Pin configuration chip information, Package information – Rainbow Electronics MAX5099 User Manual

Page 27

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MAX5099

Dual, 2.2MHz, Automotive Synchronous Buck

Converter with 80V Load-Dump Protection

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 27

© 2008 Maxim Integrated Products

is a registered trademark of Maxim Integrated Products, Inc.

MAX5099

TQFN

(5mm x 5mm)

TOP VIEW

29

30

+

28

27

*EP

*CONNECT EXPOSED PAD TO GROUND PLANE AND TO SGND.

12

11

13

DRAIN2

PGOOD2

EN2

FB2

COMP2

14

SOURCE2

DRAIN1

PGOOD1

EN1

SOURCE1

FB1

COMP1

1

2

DL1

4

5

6

7

23

24

22

20

19

18

PGND

DL2

V

L

V+

IN_HIGH

ON/OFF

DRAIN2

DRAIN1

3

21

31

10

BST2/VDD2

GATE

32

9

SOURCE2

SYNC

VDRV

26

15

SGND

BST1/VDD1

25

16

BYPASS

OSC

FSEL_1

8

17

SOURCE1

Pin Configuration

Chip Information

PROCESS: BiCMOS

Package Information

For the latest package outline information, go to

www.maxim-ic.com/packages

.

PACKAGE TYPE

PACKAGE CODE

DOCUMENT NO.

32 TQFN

T3255+4

21-0140