Telit Wireless Solutions GE863-QUAD - Manual (Page 71)

GE863-QUAD
GE863-PY
1vv0300715 Rev. 1 - 19/09/06
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Right reserved page 71 of 79
Recommendations for PCB pad dimensions
Ball pitch [mm] 2
Solder resist opening diameter A [mm] 1,150
Metal pad diameter B [mm] 1 ± 0.05
Placement of microvias not covered by solder resist is not recommended inside the “Solder resist
opening”, unless the microvia carry the same signal of the pad itself.
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish Layer thickness [µm] Properties
Electro-less Ni /
Immersion Au 3 –7 /
0.05 – 0.15 good solder ability protection, high
shear force values
The PCB must be able to resist the higher temperatures, which are occurring at the lead-free process.
This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-lead solder
paste on the described surface plating is better compared to lead-free solder paste.
13.2.5 Solder paste
Lead free
Solder paste Sn/Ag/Cu