Telit Wireless Solutions GE863-QUAD - Manual (Page 4)

GE863-QUAD
GE863-PY
1vv0300715 Rev. 1 - 19/09/06
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Right reserved page 4 of 79
12 Camera ............................................................................................................................60
12.1 Transchip Camera ..............................................................................................................60
12.1.1 Camera Interface Connectors........................................................................................................ 61
12.1.2 EVB for Transchip camera support ........................................................................................... 63
12.1.3 Block Diagram for supported cameras ..................................................................................... 64
12.1.4 Schematic Diagrams for supported camera .................................................................................. 65
12.1.5 Example usage script for camera .................................................................................................. 66
13 Mounting the GE863-QUAD / PY on the Application Board........................................67
13.1 General ...............................................................................................................................67
13.2 Module Finishing & Dimensions..........................................................................................67
13.2.1 Recommended foot print for the application.................................................................................. 69
13.2.2 Debug of the GE863 in Production................................................................................................ 70
13.2.3 Stencil ............................................................................................................................................ 70
13.2.4 PCB pad Design ............................................................................................................................ 70
13.2.5 Solder paste................................................................................................................................... 71
13.2.6 GE863-QUAD / PY Solder Reflow................................................................................................. 72
13.2.7 Packing System ............................................................................................................................. 74
13.2.8 Moisture Sensibility..................................................................................................................... 76
14 Conformity Assessment Issues....................................................................................77
15 SAFETY RECOMMANDATIONS.....................................................................................78
16 Document Change Log ..................................................................................................79