Renesas Single-Chip Microcomputer M37900T2-RPD-E - Manual (Page 13)

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Chapter 2. Preparation
This chapter describes the package components, the system configuration and the preparation for using this product for the
first time.
2.1 Terminology ............................................................................................................................... 14
2.2 Package Components.................................................................................................................. 15
2.3 Other Tool Products Required for Development........................................................................ 15
2.4 Name of Each Part ...................................................................................................................... 16
(1) System Configuration ........................................................................................................... 16
(2) Inside of the Emulation Pod.................................................................................................. 17
2.5 When Using the Emulator for the First Time ............................................................................. 18