NXP Semiconductors TDA8932B - Manual (Page 45)

TDA8932B_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 18 December 2008 45 of 48
NXP Semiconductors
TDA8932B
Class-D audio amplifier
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Abbreviations
MSL: Moisture Sensitivity Level
Fig 42. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 18. Abbreviations
Acronym Description
BTL Bridge Tied Load
DMOS Double diffused Metal Oxide Semiconductor
ESD ElectroStatic Discharge
OCP OverCurrent Protection
OTP OverTemperature Protection
OVP OverVoltage Protection
PWM Pulse Width Modulation
SE Single-Ended
TF Thermal Foldback
UBP UnBalance Protection
UVP UnderVoltage Protection
WP Window Protection