NXP Semiconductors TDA8932B - Manual (Page 16)

TDA8932B_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 18 December 2008 16 of 48
NXP Semiconductors
TDA8932B
Class-D audio amplifier
10. Limiting values
[1] V
P
= V
DDP1
−
V
SSP1
= V
DDP2
−
V
SSP2
.
[2] Measured with respect to pin INREF; V
x
< V
DD
+ 0.3 V.
[3] Measured with respect to pin V
SSD(HW)
; V
x
< V
DD
+ 0.3 V.
[4] Measured with respect to pin CGND; V
x
< V
DD
+ 0.3 V.
[5] V
SS
= V
SSP1
= V
SSP2
; V
DD
= V
DDP1
= V
DDP2
.
[6] Current limiting concept.
[7] Human Body Model (HBM); R
s
= 1500
Ω
; C = 100 pF
For pins 2, 3, 11, 14 and 15 V
esd
=
±
1800 V.
[8] Machine Model (MM); R
s
= 0
Ω
; C = 200 pF; L = 0.75
µ
H.
11. Thermal characteristics
Table 8. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
P
supply voltage asymmetrical supply [1] −
0.3 +40 V
V
x
voltage on pin x
IN1P, IN1N, IN2P, IN2N [2] −
5 +5 V
OSCREF, OSCIO, TEST [3] V
SSD(HW)
−
0.3 5 V
POWERUP, ENGAGE,
DIAG [4] V
CGND
−
0.3 6 V
all other pins [5] V
SS
−
0.3 V
DD
+ 0.3 V
I
ORM
repetitive peak output
current maximum output
current limiting [6] 4 - A
T
j
junction temperature - 150
°
C
T
stg
storage temperature
−
55 +150
°
C
T
amb
ambient temperature
−
40 +85
°
C
P power dissipation - 5 W
V
esd
electrostatic discharge
voltage HBM [7] −
2000 +2000 V
MM [8] −
200 +200 V
Table 9. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
SO32 package
R
th(j-a)
thermal resistance from junction
to ambient free air natural convection
JEDEC test board [1] - 41 44 K/W
2 layer application board [2] - 44 - K/W
Ψ
j-lead
thermal characterization
parameter from junction to lead - - 30 K/W
Ψ
j-top
thermal characterization
parameter from junction to top of
package [3] - - 8 K/W