NXP Semiconductors TDA8932B User Manual
Tda8932b, General description, Features
1.
General description
The TDA8932B is a high efficiency class-D amplifier with low power dissipation.
The continuous time output power is 2
×
15 W in stereo half-bridge application (R
L
= 4
Ω
)
or 1
×
30 W in mono full-bridge application (R
L
= 8
Ω
). Due to the low power dissipation
the device can be used without any external heat sink when playing music. Due to the
implementation of thermal foldback, even for high supply voltages and/or lower load
impedances, the device continues to operate with considerable music output power
without the need for an external heat sink.
The device has two full-differential inputs driving two independent outputs. It can be used
in a mono full-bridge configuration (BTL) or in a stereo half-bridge configuration (SE).
2.
Features
■
Operating voltage from 10 V to 36 V asymmetrical or
±
5 V to
±
18 V symmetrical
■
Mono-bridged tied load (full-bridge) or stereo single-ended (half-bridge) application
■
Application without heat sink using thermally enhanced small outline package
■
High efficiency and low-power dissipation
■
Thermally protected and thermal foldback
■
Current limiting to avoid audio holes
■
Full short-circuit proof across load and to supply lines (using advanced current
protection)
■
Switchable internal or external oscillator (master-slave setting)
■
No pop noise
■
Full-differential inputs
3.
Applications
■
Flat panel television sets
■
Flat panel monitor sets
■
Multimedia systems
■
Wireless speakers
■
Mini and micro systems
■
Home sound sets
TDA8932B
Class-D audio amplifier
Rev. 04 — 18 December 2008
Product data sheet
Document Outline
- 1. General description
- 2. Features
- 3. Applications
- 4. Quick reference data
- 5. Ordering information
- 6. Block diagram
- 7. Pinning information
- 8. Functional description
- 9. Internal circuitry
- 10. Limiting values
- 11. Thermal characteristics
- 12. Static characteristics
- 13. Dynamic characteristics
- 14. Application information
- 14.1 Output power estimation
- 14.2 Output current limiting
- 14.3 Speaker configuration and impedance
- 14.4 Single-ended capacitor
- 14.5 Gain reduction
- 14.6 Device synchronization
- 14.7 Thermal behavior (printed-circuit board considerations)
- 14.8 Pumping effects
- 14.9 SE curves measured in reference design
- 14.10 BTL curves measured in reference design
- 14.11 Typical application schematics (simplified)
- 15. Package outline
- 16. Soldering of SMD packages
- 17. Abbreviations
- 18. Revision history
- 19. Legal information
- 20. Contact information
- 21. Contents