Intel SROMBSASMR (AXXROMBSASMR) - Manual (Page 3)

Intel® Integrated RAID Module SROMBSASMR (AXXROMBSASMR) Technical Product Specification Table of Contents
Table of Contents
1. Introduction .......................................................................................................................... 1
1.1 Product Overview .................................................................................................... 1
1.2 Operating System Support ...................................................................................... 1
1.3 Features List ............................................................................................................ 2
2. Hardware ............................................................................................................................... 4
2.1 Block Diagram ......................................................................................................... 4
2.2 Module Layout ......................................................................................................... 5
2.3 Major Components .................................................................................................. 5
2.3.1 LSI* 1078 SAS ROC................................................................................................ 5
2.3.2 Flash ROM............................................................................................................... 6
2.3.3 Boot Strap ROM (SEEPROM) ................................................................................. 6
2.3.4 NVSRAM ................................................................................................................. 6
2.3.5 SDRAM (Cache) ...................................................................................................... 6
2.3.6 Diagnostics .............................................................................................................. 7
2.3.7 SAS / SATA Connectors.......................................................................................... 7
2.3.8 Host Board Interface................................................................................................ 8
2.3.9 BBU Interface ........................................................................................................ 10
2.3.10 Jumpers and Connectors....................................................................................... 12
2.4 Hardware Architectural Features ........................................................................... 12
2.5 Electrical Characteristics ....................................................................................... 13
2.6 Environmental Specifications................................................................................. 13
2.7 Supported Device Technology............................................................................... 14
2.7.1 Support for Hard Disk Drive Devices ..................................................................... 14
2.7.2 SAS Expander Support.......................................................................................... 14
2.7.3 Support for Non-Hard Disk Drive Devices ............................................................. 14
2.7.4 Enclosure Management Support ........................................................................... 14
3. Software .............................................................................................................................. 15
3.1 Common Layers .................................................................................................... 16
3.1.1 Firmware................................................................................................................ 16
3.1.2 API ......................................................................................................................... 16
3.1.3 Operating System Driver ....................................................................................... 17
Revision 1.2
Intel order number E59029-003
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