HP 512424-001 - Manual (Page 97)

4–52 Maintenance and Service Guide
Removal and replacement procedures
✎
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system
board each time the fan/heat sink assembly is removed:
■ Thermal paste is used on the processor 1 and the heat sink section 2 that services it.
■ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it.
■ Thermal pads are used on the graphics subsystem memory module 5 and the heat sink section 6 that
services it.
■ Thermal pads are used on the other system board components 7 and heat sink sections 8 that service them.
Replacement thermal material is included with all system board, fan/heat sink assembly, and processor spare
part kits.