DFI HM100-HM86 - Manual (Page 11)

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11
Chapter 2 Hardware Installation
Chapter 2
7. Seat the module vertically, pressing it down firmly until it is completely seated in the
socket. The ejector tabs at the ends of the socket will automatically snap into the locked
position to hold the module in place.
6. Grasping the module by its edges, position the module above the socket with the “notch”
in the module aligned with the “key” on the socket. The keying mechanism ensures the
module can be plugged into the socket in only one way.
Installing the Fan and Heat Sink
The CPU must be kept cool by using a CPU fan with heat sink. Without sufficient air circula-
tion across the CPU and heat sink, the CPU will overheat damaging both the CPU and system
board.
1. On the solder side of the board, match the retention module base to the mounting holes
around the CPU socket.
Retention module base
2. Turn to the component side of the board making sure the retention module base is posi-
tioned and fitted properly under the board.
3. Apply a thin layer of thermal paste on top of the CPU. Do not spread the paste all over
the surface. When you later place the heat sink on top, the compound will disperse evenly.
Note:
• Use only certified fan and heat sink.
• Your fan and heat sink package usually contains the fan and heat sink assembly,
and an installation guide. If the installation procedure in the installation guide dif-
fers from the one in this section, please follow the installation guide in the package.