BECKHOFF CB4051 - Manual (Page 64)

Chapter: Technical Data Thermal Specifications
page 64 Beckhoff New Automation Technology CB4051
8.3 Thermal Specifications
The board is specified to operate in an environmental temperature range from 0°C to +60°C (extended
temperature on request). Maximum die temperature is 100°C. To keep the processor under this threshold
an appropriate cooling solution needs to be applied. This solution has to take typical and maximum power
consumption into account. The maximum power consumption may be twice as high and should be used
as a basis for the cooling concept. Additional controllers may also affect the cooling concept. The power
consumption of such components may be comparable to the consumption of the processor.
The board design includes thermal solution mounting points that will provide the best possible thermal
interface between die and solution. Since we take thermal solutions seriously we have several advanced,
aggressive cooling solutions in our product portfolio. Please contact your sales representative to order or
discuss your thermal solution needs.
C
AUTION
The end customer has the responsibility to ensure that the die temperature of the processor does not
exceed 100°C. Permanent overheating may destroy the board!
In case the temperature exceeds 100°C the environmental temperature must be reduced. Under certain
circumstances sufficient air circulation must be provided.
C AUTION
The CB4051 includes circuitry that will notify an intelligent power supply to shut down if the processor
reaches a critical temperature. This is achieved by deasserting the (low-active) PS_ON# signal found on
the SM-Bus connector. When PS_ON# is no longer pulled low, an intelligent power supply would take this
as a signal to shut down power. For this to work, PS_ON# must be connected to the power supply's
PS_ON input. If PS_ON# is not otherwise connected, the CB4051 can be damaged beyond repair if a
thermal shutdown event occurs. In rare instances, if power is not shut down, the board will continue to
heat up until failure occurs.