BECKHOFF CB4051 - Manual (Page 12)

Chapter: Overview Specifications and Documents
page 12 Beckhoff New Automation Technology CB4051
2.2 Specifications and Documents
In making this manual and for further reading of technical documentation, the following documents,
specifications and web-pages were used and are recommended.
§ PC/104™ specification
Version 2.5
www.pc104.org
§ PC/104-Plus™ specification
Version 2.0
www.pc104.org
§ PCI-104™ specification
Version 1.0
www.pc104.org
§ PCI specification
Version 2.3 resp. 3.0
www.pcisig.com
§ PCI-Express specification
Version 1.1
www.pcisig.com
§ ACPI specification
Version 3.0
www.acpi.info
§ ATA/ATAPI specification
Version 7 Rev. 1
www.t13.org
§ USB specifications
www.usb.org
§ SM-Bus specification
Version 2.0
www.smbus.org
§ Intel® chip set description
Mobile Intel 945 Express Chipset Family Datasheet
www.intel.com
§ Intel® chip descriptions
Celeron® M, Core™ Duo/Solo, Core2™ Duo
www.intel.com
§ Winbond® chip description
W83627HG Datasheet
www.winbond-usa.com or www.winbond.com.tw
§ Intel® chip description
82562GZ Datasheet
www.intel.com
§ Intel® chip description
82573E Datasheet
www.intel.com
§ IDT® chip description
IDTCV111i Datasheet
www.idt.com