Hardware specifications – NEXCOM ICES 667 User Manual

Page 16

ICEK 667-T6 Starter Kit User Manual

Chapter 1: Product Introduction

Hardware Specifications

CPU Support

▪ Support 3rd generation Intel

Core™ i7/ i5/ i3 embedded rPGA988

processors

– Intel

Core™ i7-3610QE (4 x 2.3GHz/ 6MB cache/ Max. TDP 45W)

– Intel

Core™ i7-3610ME (2 x 2.7GHz/ 3MB cache/ Max. TDP 35W)

– Intel

Celeron® B810 (2x 1.6GHz/ 2MB cache/ Max. TDP 35W)

Main Memory

▪ Two DDR3 SO-DIMMs, 1333/ 1600 MHz SDRAM non-ECC up to 16GB

Platform Control Hub

▪ Intel

QM77 PCH (option HM76) chipset

BIOS

▪ AMI System UEFI BIOS

▪ Plug and play support

▪ Advanced Power Management and ACPI support

Display

▪ Intel

HD graphics with DX11 support and supports triple independent

displays

▪ One PCI Express x16 Lane (Gen. 3.0) down to the carried board

▪ Supports VGA, single/ dual channels LVDS 18/ 24-bit interfaces

▪ 3x DDI supports HDMI, DVI, DisplayPort and SDVO (only by Port B/ DDI #1)

Audio

▪ HD audio interface

On-board LAN

▪ Intel® 82579LM Gigabit Ethernet, support iAMT 8.0
(supported with QM77 only)

▪ Support boot from LAN, wake on LAN function

▪ Signals down to I/O board

COM Express Connector

▪ AB

VGA/ LVDS/ 8x USB 2.0, HD Audio/ 4x SATA2.0/ 3.0, GbE/ GPIO/ LPC
bus, 1x PCIe x4/ 2x PCIe x1/ SMBus (I2C)/ SPI BIOS /SPK out

▪ CD

PCIe x16(Gen. 3.0)/ 3x DDI/ 4x USB 3.0/ PCIe x1

Power Requirements

▪ +12V, +5VSB, +3.3V RTC power

Dimensions

▪ 95mm (W) x 125mm (L)

Environment

▪ Board level operating temperature: -15°C to 60°C

▪ Storage temperature: -20°C to 80°C

▪ Relative humidity:

10% to 90% (operating, non-condensing)
5% to 95% (non-operating, non-condensing)

Certifications

▪ Meet CE

▪ FCC Class A