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Hardware specifications – NEXCOM ICES 268 User Manual

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ICEK 268-T2 Starter Kit User Manual

Chapter 1: Product Introduction

Hardware Specifications

CPU Support

▪ Support Intel

®

3rd generation Core™ i7/i5/i3 embedded rPGA988

processors

– Intel

®

Core™ i7-3610QE (4x 2.3GHz/ 6MB cache/ Max. TDP 45W)

– Intel

®

Core™ i7-3610ME (2x 2.7GHz/ 3MB cache/ Max. TDP 35W)

– Intel

®

Celeron

®

B810 (2x 1.6GHz/ 2MB cache/ Max. TDP 35W)

Main Memory

▪ Two DDR3 SO-DIMMs, 1333/1600 MHz SDRAM non-ECC up to 16GB

Platform Control Hub

▪ Intel

®

QM77 PCH (optional HM76) chipset

BIOS

▪ AMI UEFI System BIOS

▪ Plug and play support

▪ Advanced Power Management and ACPI support

Display

▪ Intel

®

HD graphics with DX11 support and supports triple independent

displays

▪ One PCI Express x16 Lane (Gen 3.0) down to the carried board

▪ Supports VGA, single/dual channels LVDS 18/24-bit interfaces

▪ Optional 1x DDI port B support HDMI, DVI, DisplayPort and SDVO by PEG

with EBK-A2HDMI

Audio

▪ HD audio interface

On-board LAN

▪ Intel

®

82579LM Gigabit Ethernet, support iAMT 8.0 (supported by QM77

only)

▪ Support boot from LAN, wake on LAN function

▪ Signals down to I/O board

COM Express Connector

▪ AB

VGA/ LVDS/ 8x USB 2.0, HD Audio/ 2x SATA3.0, 2x SATA 2.0/ GbE/
GPIO/ LPC bus/ 5 x PCIex1/ SMBus (I2C)/ SPI BIOS / SPK out

▪ CD

PCIex16 (Gen. 3.0) / PCI (v2.3)/ IDE

Power Requirements

▪ +12V, +5VSB, +3.3V RTC power

Dimensions

▪ 95mm (W) x 125mm (L)

Environment

▪ Board level operating temperatures: -15°C to 60°C

▪ Storage temperatures: -20°C to 80°C

▪ Relative humidity:

▪ 10% to 90% (operating, non-condensing)

▪ 5% to 95% (non-operating, non-condensing)

Certifications

▪ CE approval

▪ FCC Class A