Hardware specifications – NEXCOM ICES 268 User Manual
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ICEK 268-T2 Starter Kit User Manual
Chapter 1: Product Introduction
Hardware Specifications
CPU Support
▪ Support Intel
®
3rd generation Core™ i7/i5/i3 embedded rPGA988
processors
– Intel
®
Core™ i7-3610QE (4x 2.3GHz/ 6MB cache/ Max. TDP 45W)
– Intel
®
Core™ i7-3610ME (2x 2.7GHz/ 3MB cache/ Max. TDP 35W)
– Intel
®
Celeron
®
B810 (2x 1.6GHz/ 2MB cache/ Max. TDP 35W)
Main Memory
▪ Two DDR3 SO-DIMMs, 1333/1600 MHz SDRAM non-ECC up to 16GB
Platform Control Hub
▪ Intel
®
QM77 PCH (optional HM76) chipset
BIOS
▪ AMI UEFI System BIOS
▪ Plug and play support
▪ Advanced Power Management and ACPI support
Display
▪ Intel
®
HD graphics with DX11 support and supports triple independent
displays
▪ One PCI Express x16 Lane (Gen 3.0) down to the carried board
▪ Supports VGA, single/dual channels LVDS 18/24-bit interfaces
▪ Optional 1x DDI port B support HDMI, DVI, DisplayPort and SDVO by PEG
with EBK-A2HDMI
Audio
▪ HD audio interface
On-board LAN
▪ Intel
®
82579LM Gigabit Ethernet, support iAMT 8.0 (supported by QM77
only)
▪ Support boot from LAN, wake on LAN function
▪ Signals down to I/O board
COM Express Connector
▪ AB
VGA/ LVDS/ 8x USB 2.0, HD Audio/ 2x SATA3.0, 2x SATA 2.0/ GbE/
GPIO/ LPC bus/ 5 x PCIex1/ SMBus (I2C)/ SPI BIOS / SPK out
▪ CD
PCIex16 (Gen. 3.0) / PCI (v2.3)/ IDE
Power Requirements
▪ +12V, +5VSB, +3.3V RTC power
Dimensions
▪ 95mm (W) x 125mm (L)
Environment
▪ Board level operating temperatures: -15°C to 60°C
▪ Storage temperatures: -20°C to 80°C
▪ Relative humidity:
▪ 10% to 90% (operating, non-condensing)
▪ 5% to 95% (non-operating, non-condensing)
Certifications
▪ CE approval
▪ FCC Class A