ADC 75 Ohm Interconnect - Manual (Page 6)

12/06 • 103978AE
Digital Monitor Module System
Digital Monitor Module System
75 Ohm Interconnect
6 w w w . a d c . c o m • + 1 - 9 5 2 - 9 3 8 - 8 0 8 0 • 1 - 8 0 0 - 3 6 6 - 3 8 9 1
High-Density Configuration
Features:
• Improved circuit density by 20%; 352 circuits in
fully loaded bay
• Cable bars reduce cable congestion and simplify
maintenance
• Circuit designation label door ensures proper
cable routing and identification
• Bay equipped with four vertical cabling channels,
cable troughs, and equipment cable tie-down
bars for high density cable management
• Zone 4 earthquake-rated equal-flange rack with
EIA mounting spacing
D3C-0016HD
Front View
IBC-D3001
Front View
IBC-D3001
Side View
Description Dimensions (HxWxD) Ordering Number
Unloaded Pair of Dual Chassis
accomodates up to 16 modules in two, eight-position chassis 88 x 236 x 165 mm
(3.5" x 9.3" x 6.5")
D3C-0016HD
600 mm Dual Skeleton Bay
accomodates up to 11 dual chassis 2200 x 600 x 250 mm
(86.7" x 23.6" x 23.6")
IBC-D3C001
O r d e r i n g I n f o r m a t i o n