Atec Tektronix-P7380A - Manual (Page 2)

Data Sheet
Z-Active™ Probing Architecture Leads the
Way for High-speed Probing Applications
Tektronix has created a revolutionary Z-Active probe architecture that sets
the industry benchmark for signal fidelity. Tektronix active probe architecture
preserves high bandwidth while providing improved connectivity with low
loading. The Z-Active architecture is a hybrid approach composed of a
distributed attenuator topology feeding an active probe amplifier.
The Z-Active probes use a tiny passive probe tip element that is separate
from the amplifier, extending the usable reach of the probe. In traditional
active probes, adding this much length can introduce signal fidelity
problems. However this architecture maintains high DC input resistance
and presents a higher AC impedance than previous probe architectures. It
accomplishes this while providing significant length between the probe body
and the probe attachment point to the DUT. This architecture provides the
best of both worlds: high DC impedance like existing active probes and the
stable high-frequency loading of Z
0
probes.
Signal Fidelity
You can be confident in the signal fidelity of your measurements because
the Z-Active architecture provides:
High Bandwidth
Excellent Step Response
Low Loading
High CMRR
Extended Linear Dynamic Range
Extended Linear Dynamic Range
Many of today’s logic signals and serial bus signals require the capability
to measure up to several volts peak to peak. These voltage levels may
easily be viewed with the Z-Active architecture probes (P7380A, P7360A,
and P7340A) with the extended linear dynamic range. With a 2.0 V
p-p
linear dynamic input range at the 5x attenuation setting, you can accurately
measure DDR II and III, Firewire 1394b, and PCI-Express I and II signals
at reduced noise levels. In addition the 25x attenuation setting’s linear
dynamic input voltage range can be used up to 5.0 V
p-p
for accessing even
larger signal swings found during transition times.
Connectivity
The Z-Active probe design allows the probe to easily switch between
soldered, handheld, or fixtured applications.
This family of probes uses Tip-Clip™ assemblies, an interchangeable
probe tip system that enables customers to configure their probe with the
optimal tip for their application. These detachable assemblies make it
possible to replace a tip for a fraction of the cost formerly associated with
such hardware changes. The several lengths and variable spacing of the
assemblies provide flexibility for adapting to vias and other test points of
differing sizes. With Tektronix Tip-Clip assemblies, Monday’s solder-in
probe can become Tuesday’s handheld tool, simply by switching tips.
Value
The combination of the Z-Active architecture and the Tip-Clip assemblies
provide superior signal fidelity at a cost-effective price. The inexpensive
Tip-Clip assemblies enable full-performance solder connections at a very
low price per connection. Over the life of a probe this can add up to
significant savings in the cost of operation.
Performance You Can Count On
Depend on Tektronix to provide you with performance you can count on. In
addition to industry-leading service and support, this product comes backed
by a one-year warranty as standard.
2 www.tektronix.com