Diodes MMBT5551 User Manual
Mmbt5551, Features, Mechanical data
MMBT5551
Document number: DS30061 Rev. 11 - 2
1 of 4
www.diodes.com
August 2008
© Diodes Incorporated
MMBT5551
NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
•
Epitaxial Planar Die Construction
•
Complementary PNP Type Available (MMBT5401)
•
Ideal for Low Power Amplification and Switching
•
Lead, Halogen and Antimony Free, RoHS Compliant
•
"Green" Device (Notes 2 and 3)
Mechanical Data
•
Case: SOT-23
•
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminal Connections: See Diagram
•
Terminals: Solderable per MIL-STD-202, Method 208
•
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
•
Marking Information: See Page 3
•
Ordering Information: See Page 3
•
Weight: 0.008 grams (approximate)
E
B
C
Device Schematic
Top View
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
V
CBO
180
V
Collector-Emitter Voltage
V
CEO
160
V
Emitter-Base Voltage
V
EBO
6.0
V
Collector Current - Continuous (Note 1)
I
C
600
mA
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 1)
P
D
300
mW
Thermal Resistance, Junction to Ambient (Note 1)
R
θJA
417
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-55 to +150
°C
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead. Halogen and Antimony Free.
3. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.