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Package outline dimensions, Suggested pad layout – Diodes DESD5V0S1BB User Manual

Page 3

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DESD5V0S1BB

Document number: DS35590 Rev. 5 - 2

3 of 4

www.diodes.com

March 2012

© Diodes Incorporated

DESD5V0S1BB

ADVAN

CE I

N

F

O

RM

ATI

O

N

0

50

25

50

75

100

125

150

P

EAK

P

U

LS

E

D

E

R

A

T

IN

G

%

O

F

P

EAK

PO

W

E

R O

R

CUR

RENT

T , AMBIENT TEMPERATURE (°C)

Fig. 3 Power Dissipation vs. Ambient Temperature

A

0

100

25

75

175 200

0.1

0

1

2

3

4

5

6

I

, L

EAK

A

G

E

C

U

R

R

EN

T

(n

A

)

R

V , REVERSE VOLTAGE (V)

R

Fig. 4 Typical Reverse Characteristics

1

10

100

1,000

T = -55°C

A

T = 25°C

A

T = 85°C

A

T = 125°C

A

T = 150°C

A



Package Outline Dimensions

























Suggested Pad Layout



















SOD523

Dim

Min

Max

A

0.25

0.35

B

0.70

0.90

C

1.50

1.70

H

1.10

1.30

K

0.55

0.65

L

0.10

0.30

M

0.10 0.12

All Dimensions in mm

Dimensions

Value (in mm)

Z

2.3

G

1.1

X

0.8

Y

0.6

C

1.7

Z

X

C

G

Y

H

C

A

B

K

M

L