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Package outline dimensions, Suggested pad layout – Diodes DESD5V0S1BA User Manual

Page 3

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DESD5V0S1BA

Document number: DS31275 Rev. 5 - 2

3 of 4

www.diodes.com

March 2012

© Diodes Incorporated

DESD5V0S1BA

ADVAN

CE I

N

F

O

RM

ATI

O

N

0

50

25

50

75

100

125

150

P

EAK

P

U

LS

E

D

E

R

A

T

IN

G

%

O

F

P

EAK

PO

W

E

R O

R

CUR

RENT

T , AMBIENT TEMPERATURE (°C)

Fig. 3 Power Dissipation vs. Ambient Temperature

A

0

100

25

75

175 200

0.1

0

1

2

3

4

5

6

I

, L

EAK

A

G

E

C

U

R

R

EN

T

(n

A

)

R

V , REVERSE VOLTAGE (V)

R

Fig. 4 Typical Reverse Characteristics

1

10

100

1,000

T = -55°C

A

T = 25°C

A

T = 85°C

A

T = 125°C

A

T = 150°C

A



Package Outline Dimensions
























Suggested Pad Layout




















SOD323

Dim Min Max

A

0.25 0.35

B

1.20 1.40

C

2.30 2.70

H

1.60 1.80

J

0.00 0.10

K

1.0 1.1

L

0.20 0.40

M

0.10 0.15

α

0° 8°

All Dimensions in mm

Dimensions

Value (in mm)

Z

3.75

G

1.05

X

0.65

Y

1.35

C

2.40

Z

X

C

G

Y

K

L

M

J

C
H

B

A