Dmc2004vk, Maximum ratings n-channel – q, Maximum ratings p-channel – q – Diodes DMC2004VK User Manual
Page 2: Thermal characteristics, Electrical characteristics n-channel – q
DMC2004VK
Document number: DS30925 Rev. 6 - 2
2 of 8
January 2013
© Diodes Incorporated
DMC2004VK
Maximum Ratings N-CHANNEL – Q
1 (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Unit
Drain Source Voltage
V
DSS
20 V
Gate-Source Voltage
V
GSS
±8
V
Drain Current (Note 5)
T
A
= +25°C
T
A
= +85°C
I
D
670
480
mA
Maximum Ratings P-CHANNEL – Q
2 (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Unit
Drain Source Voltage
V
DSS
-20 V
Gate-Source Voltage
V
GSS
±8
V
Drain Current (Note 5)
T
A
= +25°C
T
A
= +85°C
I
D
-530
-380
mA
Thermal Characteristics
Characteristic Symbol
Value
Units
Total Power Dissipation (Note 5)
P
D
0.45 W
Thermal Resistance, Junction to Ambient (Note 5)
Steady state
R
θJA
281 °C/W
t<10s 210
°C/W
Total Power Dissipation (Note 6)
P
D
1 W
Thermal Resistance, Junction to Ambient (Note 6)
Steady state
R
θJA
129 °C/W
t<10s 97
°C/W
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150
°C
Electrical Characteristics N-CHANNEL – Q
1
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Min
Typ
Max
Unit
Test
Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
20
⎯
⎯
V
V
GS
= 0V, I
D
= 10µA
Zero Gate Voltage Drain Current
I
DSS
⎯
⎯
1.0 µA
V
DS
= 16V, V
GS
= 0V
Gate-Source Leakage
I
GSS
⎯
⎯
± 1.0
µA
V
GS
= ±4.5V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
0.5
⎯
1.0 V
V
DS
= V
GS
, I
D
= 250µA
Static Drain-Source On-Resistance
R
DS (ON)
⎯
⎯
⎯
0.4
0.5
0.7
0.55
0.70
0.90
Ω
V
GS
= 4.5V, I
D
= 540mA
V
GS
= 2.5V, I
D
= 500mA
V
GS
= 1.8V, I
D
= 350mA
Forward Transfer Admittance (Note 8)
|Y
fs
|
200
⎯
⎯
mS
V
DS
=10V, I
D
= 0.2A
Diode Forward Voltage
V
SD
0.5
⎯
1.2 V
V
GS
= 0V, I
S
= 115mA
DYNAMIC CHARACTERISTICS
Input Capacitance
C
iss
⎯
⎯
150 pF
V
DS
= 16V, V
GS
= 0V
f = 1.0MHz
Output Capacitance
C
oss
⎯
⎯
25 pF
Reverse Transfer Capacitance
C
rss
⎯
⎯
20 pF
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.