Package outline dimensions, Suggested pad layout – Diodes DMP10H400SK3 User Manual
Page 5
DMP10H400SK3
Document number: DS35932 Rev. 4 - 2
5 of 6
December 2013
© Diodes Incorporated
DMP10H400SK3
NEW PROD
UC
T
Package Outline Dimensions
Suggested Pad Layout
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
t1, PULSE DURATION TIMES (sec)
Fig. 12 Transient Thermal Resistance
R
(t) = r(t) * R
R
= 68°C/W
Duty Cycle, D = t1/ t2
JA
JA
JA
0.001
0.01
0.1
r(t),
T
R
A
N
SI
E
N
T
T
H
E
R
MA
L
R
ES
IS
TA
N
C
E
1
D = 0.7
D = 0.9
D = 0.5
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
Single Pulse
TO252
Dim Min Max Typ
A
2.19 2.39 2.29
A1
0.00 0.13 0.08
A2
0.97 1.17 1.07
b
0.64 0.88 0.783
b2 0.76 1.14 0.95
b3 5.21 5.46 5.33
c2 0.45 0.58 0.531
D
6.00 6.20 6.10
D1
5.21
e
2.286
E
6.45 6.70 6.58
E1
4.32
H
9.40 10.41 9.91
L
1.40 1.78 1.59
L3 0.88 1.27 1.08
L4 0.64 1.02 0.83
a
0° 10°
All Dimensions in mm
Dimensions
Value (in mm)
Z
11.6
X1
1.5
X2
7.0
Y1
2.5
Y2
7.0
C
6.9
E1
2.3
b3
E
2X b2
D
L4
A
c2
e
A1
L
L3
3X b
a
H
A2
E1
X2
C
Z
X1
Y1
E1
Y2