Package outline dimensions, Suggested pad layout – Diodes DMP6250SE User Manual
Page 5

DMP6250SE
Document Number DS36696 Rev. 1 - 2
5 of 6
January 2014
© Diodes Incorporated
DMP6250SE
ADVAN
CE I
N
F
O
RM
ATI
O
N
NEW PROD
UC
T
t1, PULSE DURATION TIMES (sec)
Figure 13 Transient Thermal Resistance
r(t),
T
R
ANSI
EN
T
T
H
E
R
MA
L
R
ESI
S
TAN
C
E
D = 0.7
D = 0.9
D = 0.5
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
Single Pulse
R
(t) = r(t) * R
R
= 100°C/W
Duty Cycle, D = t1/ t2
θ
θ
θ
JA
JA
JA
0.001
0.01
0.1
1
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Package Outline Dimensions
Suggested Pad Layout
SOT223
Dim Min Max Typ
A 1.55 1.65 1.60
A1 0.010 0.15 0.05
b1 2.90 3.10 3.00
b2 0.60 0.80 0.70
C 0.20 0.30 0.25
D 6.45 6.55 6.50
E 3.45 3.55 3.50
E1 6.90 7.10 7.00
e — —
4.60
e1 — — 2.30
L 0.85 1.05 0.95
Q 0.84 0.94 0.89
All Dimensions in mm
Dimensions Value (in mm)
X1
3.3
X2
1.2
Y1
1.6
Y2
1.6
C1
6.4
C2
2.3
A1
A
X2
C1
C2
X1
Y2
Y1