Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMP56D0UV User Manual
Page 2: Dmp56d0uv
DMP56D0UV
Document number: DS36174 Rev. 2 - 2
2 of 5
June 2013
© Diodes Incorporated
DMP56D0UV
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Drain-Source Voltage
V
DSS
-50 V
Gate-Source Voltage
Continuous
V
GSS
8
V
Drain Current (Note 5)
Continuous
I
D
-160 mA
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
I
DM
-700 mA
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Total Power Dissipation (Note 5)
P
D
400 mW
Thermal Resistance, Junction to Ambient (Note 5)
R
JA
313
C/W
Operating and Storage Temperature Range
T
J
, T
STG
-55 to +150
C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Min
Typ
Max
Unit
Test
Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
BV
DSS
-50
V
V
GS
= 0V, I
D
= -250µA
Zero Gate Voltage Drain Current
I
DSS
-10 µA
V
DS
= -50V, V
GS
= 0V
Gate-Body Leakage
I
GSS
1
µA V
GS
=
8V, V
DS
= 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
V
GS(th)
-0.5
-1.2 V
V
DS
= V
GS
, I
D
= -250µA
Static Drain-Source On-Resistance
R
DS (ON)
4.6
6.0
6
8
Ω
V
GS
= -4V, I
D
= -100mA
V
GS
= -2.5V, I
D
= -80mA
Forward Transfer Admittance
Y
fs
100
mS V
DS
= -5V, I
D
= -100mA
Diode Forward Voltage
V
SD
-1.2 V
V
GS
= 0V, I
S
= -100mA
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
C
iss
50.54
pF
V
DS
= -25V, V
GS
= 0V, f = 1.0MHz
Output Capacitance
C
oss
3.49
pF
Reverse Transfer Capacitance
C
rss
2.42
pF
Gate Resistance
R
G
201
Ω
V
DS
= 0V, V
GS
= 0V, f = 1.0MHz
Total Gate Charge V
GS
= 4.5V
Q
g
0.58
nC
V
GS
= -4V, V
DS
= -25V,
I
D
= -100mA
Gate-Source Charge
Q
gs
0.09
nC
Gate-Drain Charge
Q
gd
0.14
nC
Turn-On Delay Time
t
D(on)
4.46
nS
V
DD
= -30V
,
I
D
= -0.27A
,
V
GEN
= -4V
,
R
GEN
= 6Ω
Turn-On Rise Time
t
r
6.63
nS
Turn-Off Delay Time
t
D(off)
21.9
nS
Turn-Off Fall Time
t
f
15.0
nS
Notes:
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to production testing.